Laird Technologies Thermal Gap Filler, Silicone, 3W/m.k Rohs Compliant Laird A10241-09

Description

THERMAL GAP FILLER, SILICONE, 3W/M.K ROHS COMPLIANT: YES

Newark, An Avnet Company

Description

THERMAL GAP FILLER, SILICONE, 3W/M.K ROHS COMPLIANT: YES

Suppliers

Company

Product

Description

Supplier Links

Newark, An Avnet Company

Chicago, IL, United States

Thermal Gap Filler, Silicone, 3W/m.k Rohs Compliant Laird
58AJ9526

Thermal Gap Filler, Silicone, 3W/m.k Rohs Compliant Laird 58AJ9526

THERMAL GAP FILLER, SILICONE, 3W/M.K ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

	Newark, An Avnet Company
Product Category	Thermal Compounds and Thermal Interface Materials
Product Number	58AJ9526
Product Name	Thermal Gap Filler, Silicone, 3W/m.k Rohs Compliant Laird

Unlock Full Specs

to access all available technical data

Similar Products

Hernon Manufacturing, Inc.

Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D

746D

Specs

Cure / Technology Room Temperature Vulcanizing or Curing

Chemical System Silicone

Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial

View Details

Quantaflex Printed Electronics Inc.

Thermal Interface Materials

Specs

Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket

Industry Electronics; Semiconductors, IC's

Features EMI/RFI Shielding

View Details

CHT USA Inc.

1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed

AS1707

Specs

Cure / Technology Single Component; Alkoxy

Chemical System Silicone

Industry Automotive; Electronics

View Details

Dongguan Sheen Electronic Technology Co., Ltd.

Thermal silicone pad for CPU heat conduction

SF500

Specs

Form / Shape Pad

Industry Electronics

Use Temperature -58 to 392 F (-50 to 200 C)

View Details