Laird Technologies RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 4200PA51H01800

Description
GK NICU PTAFG PU V0 REC
Datasheet
Description
GK NICU PTAFG PU V0 REC
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Shenzhen, China
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets
4200PA51H01800
RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets 4200PA51H01800
GK NICU PTAFG PU V0 REC

GK NICU PTAFG PU V0 REC

Supplier's Site
RFI and EMI - Contacts, Fingerstock and Gaskets - 4200PA51H01800 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
RFI and EMI - Contacts, Fingerstock and Gaskets
4200PA51H01800
RFI and EMI - Contacts, Fingerstock and Gaskets 4200PA51H01800
GK NICU PTAFG PU V0 REC

GK NICU PTAFG PU V0 REC

Buy Now Datasheet

Technical Specifications

  Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Electrodes and Electrode Materials Electrodes and Electrode Materials
Product Number 4200PA51H01800 4200PA51H01800
Product Name RF and Wireless - RFI and EMI - Contacts, Fingerstock and Gaskets RFI and EMI - Contacts, Fingerstock and Gaskets
Shape / Form Fabric Over Foam
Unlock Full Specs
to access all available technical data

Similar Products

Automotive Terminals - 1-170321-4 - TE Connectivity
Specs
Type Contact
Plating / Coating Tin; Tin (Sn)
Applications Motor or Generator
View Details
Battery Electrode Materials - PolyGrid® - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
OD / Width 12 to 48 inch (305 to 1219 mm)
Thickness 0.0020 to 0.0400 inch (0.0508 to 1.02 mm)
View Details
MicroForm - .125” - Wallner Expac
Specs
Type Anode / Anode Material; Cathode / Cathode Material
Shape / Form Diamond
Plating / Coating Nickel (optional feature)
View Details