The Wafer configuration of the DSA100 Drop Shape Analyzer is geared towards the automatic, standardized quality control of wafer surfaces and other round samples. The instrument precisely determines the homogeneity of the cleaning of a surface based on the contact angle. It also enables coatings to be characterized, for example by differences in wetting of exposed and unexposed photo varnish.
Applications
Characterization of the cleaning and coating homogeneity of wafers
Adhesion evaluation between wafer and coating
Wetting investigation of exposed and unexposed photo varnish
Ideal for analyzing other round samples, e.g. hard drives or brake disks
The Wafer configuration of the DSA100 Drop Shape Analyzer is geared towards the automatic, standardized quality control of wafer surfaces and other round samples. The instrument precisely determines the homogeneity of the cleaning of a surface based on the contact angle. It also enables coatings to be characterized, for example by differences in wetting of exposed and unexposed photo varnish.
Applications
- Characterization of the cleaning and coating homogeneity of wafers
- Adhesion evaluation between wafer and coating
- Wetting investigation of exposed and unexposed photo varnish
- Ideal for analyzing other round samples, e.g. hard drives or brake disks
