Koford Engineering, LLC Epoxy Adhesive E110

E-110 is a high performance unfilled single component modified epoxy adhesive which can be cured at125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable for applications for bonding bearings andmagnets and other applications where dissimilar materials are bonded and must withstand long term thermalcycling and the 180°C cure temperature of E-107 cannot be tolerated. Offers much higher hot bond strengthand long term durability then modified acrylic adhesives or conventional epoxies. Has good adhesion toplastics as well as metal and ceramics. Because it is unfilled it does does create a bondline gap which wouldlead to reduced magnetic circuit efficiency or dimensional variation.