E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic applications. Rapid cure speedmake it an excellent choice for automatic assembly using IR. induction, or hot air cure. Suitable for use withautomatic dispensing equipment.
| Koford Engineering, LLC | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | E109 |
| Product Name | Epoxy Adhesive |
| Cure / Technology | Thermoset; Single Component |
