An improved, simpler, less costly method of semiconductor mounting. Avoid soldering directly to the semiconductor. Easier to service, economical, more efficient. Semiconductor not included.
Materials: Socket Base: Phenolic, XP Grade. Contacts: Brass, Tin Plate. Top Plate: Nylon per ASTM-D4066. Collector Plate: 0.030 Steel, Tin Plate. Screws: Steel, Type B.
| Allied Electronics, Inc. | |
|---|---|
| Product Category | IC Interconnect Components |
| Product Number | 70182106 |
| Product Name | Kit |
