Ironwood Electronics, Inc. Spring Pin Socket SS-BGA324E-01

Description
Ironwood Electronics Giga-Spring™ (POGO) are small footprint socket compatible with the GHz elastomer sockets with increased endurance and temperature range. The 1mm contactor is a spring pin (pogo) with 30 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.62 nH with a loss of < 1 dB at 10 GHz. The current capacity of each contactor is 4 amps at ambient temperature. Socket temperature range is -40C to +150C. The socket is mounted to the PCB with a backing plate and requires only 2.54mm border around the IC. The socket is constructed of aluminum which provides heatsinking up to 7.5 watts. Custom heatsinks can easily be designed for higher power dissipation. The user simply places the IC into the socket, closes the lid, and rotates the heatsink screw to seat the IC. PCB finish on pads can be HASL, Immersion, Au, Immersion Ag, or tin. The Giga- Spring family of sockets provide a small footprint high endurance socket for 0.4 to 1.27mm pitch BGA, LGA, and QFN IC's.
Datasheet
Description
Ironwood Electronics Giga-Spring™ (POGO) are small footprint socket compatible with the GHz elastomer sockets with increased endurance and temperature range. The 1mm contactor is a spring pin (pogo) with 30 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.62 nH with a loss of < 1 dB at 10 GHz. The current capacity of each contactor is 4 amps at ambient temperature. Socket temperature range is -40C to +150C. The socket is mounted to the PCB with a backing plate and requires only 2.54mm border around the IC. The socket is constructed of aluminum which provides heatsinking up to 7.5 watts. Custom heatsinks can easily be designed for higher power dissipation. The user simply places the IC into the socket, closes the lid, and rotates the heatsink screw to seat the IC. PCB finish on pads can be HASL, Immersion, Au, Immersion Ag, or tin. The Giga- Spring family of sockets provide a small footprint high endurance socket for 0.4 to 1.27mm pitch BGA, LGA, and QFN IC's.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Spring Pin Socket - SS-BGA324E-01 - Ironwood Electronics, Inc.
Burnsville, MN, USA
Spring Pin Socket
SS-BGA324E-01
Spring Pin Socket SS-BGA324E-01
Ironwood Electronics Giga-Spring™ (POGO) are small footprint socket compatible with the GHz elastomer sockets with increased endurance and temperature range. The 1mm contactor is a spring pin (pogo) with 30 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.62 nH with a loss of < 1 dB at 10 GHz. The current capacity of each contactor is 4 amps at ambient temperature. Socket temperature range is -40C to +150C. The socket is mounted to the PCB with a backing plate and requires only 2.54mm border around the IC. The socket is constructed of aluminum which provides heatsinking up to 7.5 watts. Custom heatsinks can easily be designed for higher power dissipation. The user simply places the IC into the socket, closes the lid, and rotates the heatsink screw to seat the IC. PCB finish on pads can be HASL, Immersion, Au, Immersion Ag, or tin. The Giga- Spring family of sockets provide a small footprint high endurance socket for 0.4 to 1.27mm pitch BGA, LGA, and QFN IC's.

Ironwood Electronics Giga-Spring™ (POGO) are small footprint socket compatible with the GHz elastomer sockets with increased endurance and temperature range. The 1mm contactor is a spring pin (pogo) with 30 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.62 nH with a loss of < 1 dB at 10 GHz. The current capacity of each contactor is 4 amps at ambient temperature. Socket temperature range is -40C to +150C. The socket is mounted to the PCB with a backing plate and requires only 2.54mm border around the IC. The socket is constructed of aluminum which provides heatsinking up to 7.5 watts. Custom heatsinks can easily be designed for higher power dissipation. The user simply places the IC into the socket, closes the lid, and rotates the heatsink screw to seat the IC. PCB finish on pads can be HASL, Immersion, Au, Immersion Ag, or tin. The Giga- Spring family of sockets provide a small footprint high endurance socket for 0.4 to 1.27mm pitch BGA, LGA, and QFN IC's.

Supplier's Site Datasheet

Technical Specifications

  Ironwood Electronics, Inc.
Product Category IC Interconnect Components
Product Number SS-BGA324E-01
Product Name Spring Pin Socket
Product Type IC Socket
Socket Type BGA
Mounting ZIF, Direct Mount, Solderless
Features Solderless; ZIF Lock; Clamshell Socket
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