The SG-BGA-6099 GHz BGA Socket from Ironwood Electronics, Inc. is designed for high-frequency applications, providing a bandwidth of 6.5 to 10 GHz. This socket utilizes a zero insertion force (ZIF) mechanism, allowing for easy chip placement without soldering, which is beneficial for prototyping and testing. The socket features a low resistance elastomer connector with a contact resistance of less than 0.01Oc, ensuring efficient electrical performance. The socket is compatible with various BGA package sizes and pitches, specifically accommodating 1.27mm, 1.0mm, 0.8mm, and 0.75mm pitches. It requires specific PCB layout considerations for mounting and alignment, and it is designed to handle a maximum total height of the IC and solder ball dimensions as specified in the datasheet. The elastomer used in the socket has a lifespan of approximately 200 cycles before requiring cleaning, and it operates effectively within a temperature range of -35¬8C to +85¬8C, with short-term exposure up to 100¬8C. Engineers should consider this socket for applications requiring high-speed testing and prototyping, particularly where soldering is not feasible or desired.
Ironwood's GHz BGA sockets are ideal sockets for prototyping, test applications, and field-upgradeable designs. These patent pending sockets are the smallest, fastest, and densest BGA sockets available. Direct mount versions of the sockets offer the highest performance and completely eliminate soldering. The zero insertion force (ZIF) chip placement system can also provide heat sink capability.
| Ironwood Electronics, Inc. | |
|---|---|
| Product Category | IC Interconnect Components |
| Product Number | SG-BGA-6099 |
| Product Name | GHz BGA Socket |
| Product Type | IC Socket |
| Socket Type | BGA |
| Mounting | ZIF, Direct Mount, Solderless |
| Features | Solderless; ZIF Lock; Screw Lock |
| Military Standards | MIL-STD202 |
