0.5mm and 0.65mm pitch
Low cost / high performance achieved through use of carrier loaded stamped contact
"U" contact supports any type of solder ball shape and composition
Compact outline and low actuation force achieved through use of advanced latching mechanism
Thru hole design
Sensata Technologies
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Description
0.5mm and 0.65mm pitch
Low cost / high performance achieved through use of carrier loaded stamped contact
"U" contact supports any type of solder ball shape and composition
Compact outline and low actuation force achieved through use of advanced latching mechanism
Thru hole design
0.5mm and 0.65mm pitch
Low cost / high performance achieved through use of carrier loaded stamped contact
"U" contact supports any type of solder ball shape and composition
Compact outline and low actuation force achieved through use of advanced latching mechanism
Thru hole design
0.5mm and 0.65mm pitch
Low cost / high performance achieved through use of carrier loaded stamped contact
"U" contact supports any type of solder ball shape and composition
Compact outline and low actuation force achieved through use of advanced latching mechanism
