These adapters allow SOIC packages to be mounted on DIP through hole patterns. The SOIC device is soldered to the adapter's surface mount lands, giving the highest possible reliability. The adapter will accomodate J-leaded or gull wing SOIC devices.
| Ironwood Electronics, Inc. | |
|---|---|
| Product Category | IC Interconnect Components |
| Product Number | PC-TSOP/DIP8-01 |
| Product Name | SOIC To DIP Package Converter |
| Product Type | Package Adapters / Converters |
