Ironwood Electronics, Inc. SOIC To DIP Package Converter PC-TSOP/DIP40-01

Description
These adapters allow SOIC packages to be mounted on DIP through hole patterns. The SOIC device is soldered to the adapter's surface mount lands, giving the highest possible reliability. The adapter will accomodate J-leaded or gull wing SOIC devices.
Description
These adapters allow SOIC packages to be mounted on DIP through hole patterns. The SOIC device is soldered to the adapter's surface mount lands, giving the highest possible reliability. The adapter will accomodate J-leaded or gull wing SOIC devices.

Suppliers

Company
Product
Description
Supplier Links
Burnsville, MN, USA
SOIC To DIP Package Converter
PC-TSOP/DIP40-01
SOIC To DIP Package Converter PC-TSOP/DIP40-01
These adapters allow SOIC packages to be mounted on DIP through hole patterns. The SOIC device is soldered to the adapter's surface mount lands, giving the highest possible reliability. The adapter will accomodate J-leaded or gull wing SOIC devices.

These adapters allow SOIC packages to be mounted on DIP through hole patterns. The SOIC device is soldered to the adapter's surface mount lands, giving the highest possible reliability. The adapter will accomodate J-leaded or gull wing SOIC devices.

Supplier's Site

Technical Specifications

  Ironwood Electronics, Inc.
Product Category IC Interconnect Components
Product Number PC-TSOP/DIP40-01
Product Name SOIC To DIP Package Converter
Product Type Package Adapters / Converters
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