The IC device is soldered directly to surface mount lands on the upper assembly. These are the least expensive, yet most electrically stable, of our QFP probing adapter upper assemblies. In some cases, the option of square or rectangular pads is offered.
The IC device is soldered directly to surface mount lands on the upper assembly. These are the least expensive, yet most electrically stable, of our QFP probing adapter upper assemblies. In some cases, the option of square or rectangular pads is offered.
| Ironwood Electronics, Inc. | |
|---|---|
| Product Category | IC Interconnect Components |
| Product Number | CA-QFE80RA-L-Z-T-01 |
| Product Name | QFL Probing Adaptor |
| Product Type | IC Probing / Analysis Adapters |
| RoHS Compliant | RoHS Compliant (optional feature) |
| Socket Type | QFP; Probing Adaptor |
| Features | Solderless; ZIF Lock; Clamshell Socket |
