IPC International, Inc. Semiconductor Design Standard for Flip Chip Applications J-STD-026

Description
DESCRIPTION This standard addresses semiconductor flip chip design requirements. Provides information for using standard semiconductor substrates, materials, assembly and test methods with established fabrication, bumping, test and handling practices. Electrical, thermal and mechanical chip design parameters and methodologies are covered in the standard, as well as the reliability aspects associated with these conditions and processes. The information applies to all new designs as well as modifications of non-flip chip designs. Developed by IPC and EIA.
  • Semiconductor Design Standard for Flip Chip Applications - J-STD-026 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This standard addresses semiconductor flip chip design requirements. Provides information for using standard semiconductor substrates, materials, assembly and test methods with established fabrication, bumping, test and handling practices. Electrical, thermal and mechanical chip design parameters and methodologies are covered in the standard, as well as the reliability aspects associated with these conditions and processes. The information applies to all new designs as well as modifications of non-flip chip designs. Developed by IPC and EIA.

Suppliers

Company
Product
Description
Supplier Links
Semiconductor Design Standard for Flip Chip Applications - J-STD-026 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Semiconductor Design Standard for Flip Chip Applications
J-STD-026
Semiconductor Design Standard for Flip Chip Applications J-STD-026
DESCRIPTION This standard addresses semiconductor flip chip design requirements. Provides information for using standard semiconductor substrates, materials, assembly and test methods with established fabrication, bumping, test and handling practices. Electrical, thermal and mechanical chip design parameters and methodologies are covered in the standard, as well as the reliability aspects associated with these conditions and processes. The information applies to all new designs as well as modifications of non-flip chip designs. Developed by IPC and EIA.


DESCRIPTION
This standard addresses semiconductor flip chip design requirements. Provides information for using standard semiconductor substrates, materials, assembly and test methods with established fabrication, bumping, test and handling practices. Electrical, thermal and mechanical chip design parameters and methodologies are covered in the standard, as well as the reliability aspects associated with these conditions and processes. The information applies to all new designs as well as modifications of non-flip chip designs. Developed by IPC and EIA.

Supplier's Site

Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number J-STD-026
Product Name Semiconductor Design Standard for Flip Chip Applications
Unlock Full Specs
to access all available technical data

Similar Products