IPC International, Inc. Technology Package EXESUM10-10-TECHPACK

Description
DESCRIPTION This is a collection of three papers, "Oportunities in the Value Chain for the Next Wave of HBLEDs" by Leonard Livschitz, President and CEO, Luxera, Inc., "Core Enabling Process Technologies Driving Electronics Innovation" by Phil Plonski, Managing Partner, Prismark Partners and "New Advances in Miniaturization: It's Not Just for Consumer Electronics" by Jim Fuller, Vice President PWB Engineering, Endicott Interconnect Technologies. The first paper discusses opportunities for PCB development in LED drivers. The second discusses areas for innovation in growth segments of the electronics industry. These include light, radios, antennas, packaging, MEMS, and power management. The last paper shows the history of miniaturization of consumer electronics and how it benefits the United States to be in the forefront of development.This package includes the synchronized slides and recorded audio from the live presentations at the IPC Executive Summit meeting in October 2010. 1 hour 30 minutes. Released 2011.
  • Technology Package - EXESUM10-10-TECHPACK - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This is a collection of three papers, "Oportunities in the Value Chain for the Next Wave of HBLEDs" by Leonard Livschitz, President and CEO, Luxera, Inc., "Core Enabling Process Technologies Driving Electronics Innovation" by Phil Plonski, Managing Partner, Prismark Partners and "New Advances in Miniaturization: It's Not Just for Consumer Electronics" by Jim Fuller, Vice President PWB Engineering, Endicott Interconnect Technologies. The first paper discusses opportunities for PCB development in LED drivers. The second discusses areas for innovation in growth segments of the electronics industry. These include light, radios, antennas, packaging, MEMS, and power management. The last paper shows the history of miniaturization of consumer electronics and how it benefits the United States to be in the forefront of development.This package includes the synchronized slides and recorded audio from the live presentations at the IPC Executive Summit meeting in October 2010. 1 hour 30 minutes. Released 2011.

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Technology Package - EXESUM10-10-TECHPACK - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
Technology Package
EXESUM10-10-TECHPACK
Technology Package EXESUM10-10-TECHPACK
DESCRIPTION This is a collection of three papers, "Oportunities in the Value Chain for the Next Wave of HBLEDs" by Leonard Livschitz, President and CEO, Luxera, Inc., "Core Enabling Process Technologies Driving Electronics Innovation" by Phil Plonski, Managing Partner, Prismark Partners and "New Advances in Miniaturization: It's Not Just for Consumer Electronics" by Jim Fuller, Vice President PWB Engineering, Endicott Interconnect Technologies. The first paper discusses opportunities for PCB development in LED drivers. The second discusses areas for innovation in growth segments of the electronics industry. These include light, radios, antennas, packaging, MEMS, and power management. The last paper shows the history of miniaturization of consumer electronics and how it benefits the United States to be in the forefront of development.This package includes the synchronized slides and recorded audio from the live presentations at the IPC Executive Summit meeting in October 2010. 1 hour 30 minutes. Released 2011.

DESCRIPTION
This is a collection of three papers, "Oportunities in the Value Chain for the Next Wave of HBLEDs" by Leonard Livschitz, President and CEO, Luxera, Inc., "Core Enabling Process Technologies Driving Electronics Innovation" by Phil Plonski, Managing Partner, Prismark Partners and "New Advances in Miniaturization: It's Not Just for Consumer Electronics" by Jim Fuller, Vice President PWB Engineering, Endicott Interconnect Technologies. The first paper discusses opportunities for PCB development in LED drivers. The second discusses areas for innovation in growth segments of the electronics industry. These include light, radios, antennas, packaging, MEMS, and power management. The last paper shows the history of miniaturization of consumer electronics and how it benefits the United States to be in the forefront of development.This package includes the synchronized slides and recorded audio from the live presentations at the IPC Executive Summit meeting in October 2010. 1 hour 30 minutes. Released 2011.

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number EXESUM10-10-TECHPACK
Product Name Technology Package
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