IPC International, Inc. HDI Assembly Related Issues ASSEMBLYISSUE-03-11

Description
DESCRIPTION This presentation "HDI Assembly Related Issues" was given by Ian Williams, manager of customer interconnect core competency team at Intel Corp. at the IPC Conference on HDI Technology High Performance: Strategies for the 21st Century at Baltimore, Md., in March 2011. The author describes an Intel investigation into assembly challenges, capabilities, quality, reliability and testability of HDI designed boards. The component pad pitch and surface preparation impact on board quality and reliability are described as well as methods to strengthen solder joints. The challenges of rework are also discussed. The presentation includes synchronized audio and video from the live presentation. 33 minutes. Released 2011
  • HDI Assembly Related Issues - ASSEMBLYISSUE-03-11 - IPC International, Inc.
    IPC International, Inc.
Description
DESCRIPTION This presentation "HDI Assembly Related Issues" was given by Ian Williams, manager of customer interconnect core competency team at Intel Corp. at the IPC Conference on HDI Technology High Performance: Strategies for the 21st Century at Baltimore, Md., in March 2011. The author describes an Intel investigation into assembly challenges, capabilities, quality, reliability and testability of HDI designed boards. The component pad pitch and surface preparation impact on board quality and reliability are described as well as methods to strengthen solder joints. The challenges of rework are also discussed. The presentation includes synchronized audio and video from the live presentation. 33 minutes. Released 2011

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HDI Assembly Related Issues - ASSEMBLYISSUE-03-11 - IPC International, Inc.
IPC International, Inc.
Bannockburn, IL, United States
HDI Assembly Related Issues
ASSEMBLYISSUE-03-11
HDI Assembly Related Issues ASSEMBLYISSUE-03-11
DESCRIPTION This presentation "HDI Assembly Related Issues" was given by Ian Williams, manager of customer interconnect core competency team at Intel Corp. at the IPC Conference on HDI Technology High Performance: Strategies for the 21st Century at Baltimore, Md., in March 2011. The author describes an Intel investigation into assembly challenges, capabilities, quality, reliability and testability of HDI designed boards. The component pad pitch and surface preparation impact on board quality and reliability are described as well as methods to strengthen solder joints. The challenges of rework are also discussed. The presentation includes synchronized audio and video from the live presentation. 33 minutes. Released 2011

DESCRIPTION
This presentation "HDI Assembly Related Issues" was given by Ian Williams, manager of customer interconnect core competency team at Intel Corp. at the IPC Conference on HDI Technology High Performance: Strategies for the 21st Century at Baltimore, Md., in March 2011. The author describes an Intel investigation into assembly challenges, capabilities, quality, reliability and testability of HDI designed boards. The component pad pitch and surface preparation impact on board quality and reliability are described as well as methods to strengthen solder joints. The challenges of rework are also discussed. The presentation includes synchronized audio and video from the live presentation. 33 minutes. Released 2011

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Technical Specifications

  IPC International, Inc.
Product Category Standards and Technical Documents
Product Number ASSEMBLYISSUE-03-11
Product Name HDI Assembly Related Issues
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