Home

Products & Services

Engineering News

Standards

Webinars

Engineering Forum

Intel Corporation Modems - ICs and Modules PSB8305VV1.1

Description

Modem

Quarktwin Technology Ltd.

Description

Modem

Suppliers

Company

Product

Description

Supplier Links

Modems - ICs and Modules - PSB8305VV1.1 - Quarktwin Technology Ltd.

Quarktwin Technology Ltd.

Shenzhen, Guangdong, China

Modems - ICs and Modules
PSB8305VV1.1

Modems - ICs and Modules PSB8305VV1.1

Modem

Buy Now

Acme Chip Technology Co., Limited

Shenzhen, China

Integrated Circuits (ICs) - Interface - Modems - ICs and Modules
PSB8305VV1.1

Integrated Circuits (ICs) - Interface - Modems - ICs and Modules PSB8305VV1.1

XWAY WAV300 WI-FI CHIPSET

Supplier's Site

Technical Specifications

	Quarktwin Technology Ltd.	Acme Chip Technology Co., Limited
Product Category	IC Interfaces	IC Interfaces
Product Number	PSB8305VV1.1	PSB8305VV1.1
Product Name	Modems - ICs and Modules	Integrated Circuits (ICs) - Interface - Modems - ICs and Modules
Features	RoHS

Unlock Full Specs

to access all available technical data

Similar Products

- 54ACT241J-QMLV - Rochester Electronics

Texas Instruments

Integrated Circuits (ICs) - Logic - Buffers, Drivers, Receivers, Transceivers

Specs

Device Type Line / Bus Driver

Package Type DIP; DIP20

2 suppliers

Integrated Circuits (ICs) - Interface - Analog Switches, Multiplexers, Demultiplexers - 74HCT4051D-Q100,11 - Shenzhen Shengyu Electronics Technology Limited

Nexperia B.V.

Integrated Circuits (ICs) - Interface - Analog Switches, Multiplexers, Demultiplexers

74HCT4051D-Q100,11

Specs

Device Type Sensor Interface

Operating Temperature -40 to 125 C (-40 to 257 F)

Package Type 16-SOIC (0.154\", 3.90mm Width)

RF Front End (LNA + PA) - 2312-QPF4730SRCT-ND - DigiKey

Qorvo

RF Front End (LNA + PA)

Specs

Device Type Front End

Package Type 16-QFN Exposed Pad

Pins 16 #

Rochester Electronics

Integrated Circuits (ICs) - Logic - Buffers, Drivers, Receivers, Transceivers

Specs

Device Type Receiver; Buffer