Integrated Silicon Solution, Inc. Integrated Circuits (ICs) - Memory - Memory IS61DDP2B251236A-400M3L

Description
IC SRAM 18MBIT PARALLEL 165LFBGA
Description
IC SRAM 18MBIT PARALLEL 165LFBGA
Datasheet
Datasheet Summary
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The IS61DDP2B251236A-400M3L is an 18Mb synchronous static random access memory (SRAM) device from Quarktwin Technology Ltd. It features a double data rate (DDR) interface with a 2.0 cycle read latency, allowing for efficient read and write operations. The memory is organized in a 512Kx36 configuration and supports a common I/O bus for simultaneous read and write operations. This SRAM includes an on-chip Delay-Locked Loop (DLL) to enhance data validity and offers a fixed 2-bit burst for both read and write operations. It operates with a core power supply of +1.8V and supports HSTL input/output interfaces. The device is packaged in a fine ball grid array (FBGA) format, with dimensions of 15mm x 17mm and 165 balls, making it suitable for compact designs. Additional features include registered addresses and control signals, byte write capability, and optional on-die termination (ODT) for improved signal integrity. The device is designed for high-performance applications where speed and reliability are critical.

Datasheet Summary
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The IS61DDP2B251236A-400M3L is an 18Mb synchronous static random access memory (SRAM) device from Quarktwin Technology Ltd. It features a double data rate (DDR) interface with a 2.0 cycle read latency, allowing for efficient read and write operations. The memory is organized in a 512Kx36 configuration and supports a common I/O bus for simultaneous read and write operations. This SRAM includes an on-chip Delay-Locked Loop (DLL) to enhance data validity and offers a fixed 2-bit burst for both read and write operations. It operates with a core power supply of +1.8V and supports HSTL input/output interfaces. The device is packaged in a fine ball grid array (FBGA) format, with dimensions of 15mm x 17mm and 165 balls, making it suitable for compact designs. Additional features include registered addresses and control signals, byte write capability, and optional on-die termination (ODT) for improved signal integrity. The device is designed for high-performance applications where speed and reliability are critical.

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Memory - Memory - IS61DDP2B251236A-400M3L - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
IS61DDP2B251236A-400M3L
Integrated Circuits (ICs) - Memory - Memory IS61DDP2B251236A-400M3L
IC SRAM 18MBIT PARALLEL 165LFBGA

IC SRAM 18MBIT PARALLEL 165LFBGA

Supplier's Site
SRAM - Synchronous, DDR IIP Memory IC 18Mbit Parallel 400 MHz 165-LFBGA (15x17)

SRAM - Synchronous, DDR IIP Memory IC 18Mbit Parallel 400 MHz 165-LFBGA (15x17)

Buy Now Datasheet
IC SRAM 18MBIT PARALLEL 165LFBGA

IC SRAM 18MBIT PARALLEL 165LFBGA

Supplier's Site Datasheet
18Mb, Ddr Iip (Burst Of 2) Cio, Sync Sram, 512K X 36, 2.0 Read Latency, 165 Ball Fbga (15X17 Mm), Rohs Integrated Silicon Solution (Issi) - 77T0715 - Newark, An Avnet Company
Chicago, IL, United States
18Mb, Ddr Iip (Burst Of 2) Cio, Sync Sram, 512K X 36, 2.0 Read Latency, 165 Ball Fbga (15X17 Mm), Rohs Integrated Silicon Solution (Issi)
77T0715
18Mb, Ddr Iip (Burst Of 2) Cio, Sync Sram, 512K X 36, 2.0 Read Latency, 165 Ball Fbga (15X17 Mm), Rohs Integrated Silicon Solution (Issi) 77T0715
18Mb, DDR IIP (Burst of 2) CIO, Sync SRAM, 512K x 36, 2.0 Read Latency, 165 Ball FBGA (15x17 mm), RoHS

18Mb, DDR IIP (Burst of 2) CIO, Sync SRAM, 512K x 36, 2.0 Read Latency, 165 Ball FBGA (15x17 mm), RoHS

Supplier's Site

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd. Lingto Electronic Limited Newark, An Avnet Company
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number IS61DDP2B251236A-400M3L IS61DDP2B251236A-400M3L IS61DDP2B251236A-400M3L 77T0715
Product Name Integrated Circuits (ICs) - Memory - Memory Memory Memory 18Mb, Ddr Iip (Burst Of 2) Cio, Sync Sram, 512K X 36, 2.0 Read Latency, 165 Ball Fbga (15X17 Mm), Rohs Integrated Silicon Solution (Issi)
Memory Category Volatile; SRAM Chip SRAM; SRAM Chip SRAM; SRAM Chip SRAM Chip
Data Rate 400 MHz
Density 18000 kbits 18000 kbits 18000 kbits
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