Manufacturer: ISSI, Integrated Silicon Solution Inc
Win Source Part Number: 921666-IS43LD32160A-
Operating Temperature Range: -40°C ~ 85°C (TC)
Features: SDRAM - Mobile LPDDR2-S4 Memory IC 512Mb (16M x 32) Parallel 400 MHz 134-TFBGA (10x11.5)
Package: 134-TFBGA
Package: Tray
Mounting: Surface Mount
Family Name: IS43LD32160
Categories: Integrated Circuits (ICs)
Case / Package: 134-TFBGA (10x11.5)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 49 pct.
Supply and Demand Status: Balance
Quantity per package: 171
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 19 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0028
SDRAM - Mobile LPDDR2-S4 Memory IC 512Mb (16M x 32) Parallel 400MHz 134-TFBGA (10x11.5)
IC DRAM 512MBIT PAR 134TFBGA
IC DRAM 512MBIT PAR 134TFBGA
SDRAM - Mobile LPDDR2-S4 Memory IC 512Mbit Parallel 400 MHz 134-TFBGA (10x11.5)
| Win Source Electronics | DigiKey | Shenzhen Shengyu Electronics Technology Limited | Lingto Electronic Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 921666-IS43LD32160A-25BLI | IS43LD32160A-25BLI-ND | IS43LD32160A-25BLI | IS43LD32160A-25BLI | IS43LD32160A-25BLI |
| Product Name | Memory - SDRAM - IS43LD32160A-25BLI | Memory | Integrated Circuits (ICs) - Memory | Memory | Memory |
| Memory Category | DRAM Chip | DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | DRAM; DRAM Chip |
| Operating Temperature | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | |
| Package Type | BGA; 134-TFBGA (10x11.5) | 134-TFBGA | BGA | BGA; 134-TFBGA |
