Integrated Silicon Solution, Inc. Memory IS43LD16640A-25BL-TR

Description
SDRAM - Mobile LPDDR2 Memory IC 1Gb (64M x 16) Parallel 400MHz 134-TFBGA (10x11.5)
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Description
SDRAM - Mobile LPDDR2 Memory IC 1Gb (64M x 16) Parallel 400MHz 134-TFBGA (10x11.5)
Request a Quote
Datasheet
Datasheet Summary
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The IS43LD16640A-25BL-TR is a 1Gb mobile LPDDR2 SDRAM memory device organized as 8 banks, available in configurations of 64Mx16 or 32Mx32. It operates with low-voltage power supplies, specifically VDD2 and VDDCA/VDDQ ranging from 1.14V to 1.30V, and VDD1 from 1.70V to 1.95V. The device supports a clock frequency range of 10MHz to 400MHz, achieving data rates from 20Mbps to 800Mbps per I/O through a four-bit pre-fetch DDR architecture. This memory features high-speed un-terminated logic (HSUL_12) I/O interface, programmable read/write latencies, and burst lengths of 4, 8, or 16. It includes advanced functionalities such as per-bank refresh for concurrent operation, ZQ calibration, and an on-chip temperature sensor to manage self-refresh rates. The device is suitable for commercial, industrial, and automotive applications, with operating temperature ranges from -40¬8C to 105¬8C depending on the specific variant. The package options include a 134-ball BGA for x16/x32 configurations.

Datasheet Summary
Powered by GS/AI

The IS43LD16640A-25BL-TR is a 1Gb mobile LPDDR2 SDRAM memory device organized as 8 banks, available in configurations of 64Mx16 or 32Mx32. It operates with low-voltage power supplies, specifically VDD2 and VDDCA/VDDQ ranging from 1.14V to 1.30V, and VDD1 from 1.70V to 1.95V. The device supports a clock frequency range of 10MHz to 400MHz, achieving data rates from 20Mbps to 800Mbps per I/O through a four-bit pre-fetch DDR architecture. This memory features high-speed un-terminated logic (HSUL_12) I/O interface, programmable read/write latencies, and burst lengths of 4, 8, or 16. It includes advanced functionalities such as per-bank refresh for concurrent operation, ZQ calibration, and an on-chip temperature sensor to manage self-refresh rates. The device is suitable for commercial, industrial, and automotive applications, with operating temperature ranges from -40¬8C to 105¬8C depending on the specific variant. The package options include a 134-ball BGA for x16/x32 configurations.

Suppliers

Company
Product
Description
Supplier Links
Memory - IS43LD16640A-25BL-TR-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR2 Memory IC 1Gb (64M x 16) Parallel 400MHz 134-TFBGA (10x11.5)

SDRAM - Mobile LPDDR2 Memory IC 1Gb (64M x 16) Parallel 400MHz 134-TFBGA (10x11.5)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - IS43LD16640A-25BL-TR - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
IS43LD16640A-25BL-TR
Integrated Circuits (ICs) - Memory IS43LD16640A-25BL-TR
IC DRAM 1GBIT PARALLEL 134TFBGA

IC DRAM 1GBIT PARALLEL 134TFBGA

Supplier's Site
Memory - IS43LD16640A-25BL-TR - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR2 Memory IC 1Gbit Parallel 400 MHz 134-TFBGA (10x11.5)

SDRAM - Mobile LPDDR2 Memory IC 1Gbit Parallel 400 MHz 134-TFBGA (10x11.5)

Buy Now Datasheet
IC DRAM 1GBIT PARALLEL 134TFBGA

IC DRAM 1GBIT PARALLEL 134TFBGA

Supplier's Site Datasheet

Technical Specifications

  DigiKey Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd. Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number IS43LD16640A-25BL-TR-ND IS43LD16640A-25BL-TR IS43LD16640A-25BL-TR IS43LD16640A-25BL-TR
Product Name Memory Integrated Circuits (ICs) - Memory Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Operating Temperature 0 to 85 C (32 to 185 F) 0 to 85 C (32 to 185 F) 0 to 85 C (32 to 185 F)
Package Type 134-TFBGA BGA BGA; 134-TFBGA
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