Integrated Silicon Solution, Inc. Memory IS43DR82560B-25EBL-TR

Description
SDRAM - DDR2 Memory IC 2Gbit Parallel 400 MHz 400 ps 60-TWBGA (10.5x13)
Description
SDRAM - DDR2 Memory IC 2Gbit Parallel 400 MHz 400 ps 60-TWBGA (10.5x13)
Datasheet
Datasheet Summary
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The IS43DR82560B-25EBL-TR is a 2Gb DDR2 SDRAM memory chip featuring a double data rate architecture that allows for high-speed operation with a 4n-prefetch design. It operates at a voltage of 1.8V ±0.1V and is compatible with JEDEC standard 1.8V I/O (SSTL_18). The device supports programmable CAS latency options of 3, 4, 5, 6, and 7, along with adjustable burst lengths of 4 or 8. It includes eight internal banks for concurrent operations and features on-die termination (ODT) for improved signal integrity. The memory chip is available in a 60-ball BGA package measuring 10.5mm x 13mm and is suitable for commercial, industrial, and automotive applications, with temperature ranges from -40°C to 105°C for automotive grades. Key timing parameters include a cycle time of 2.5ns at CL=6 for DDR2-800E and 3.0ns at CL=5 for DDR2-667D. This product is designed for applications requiring reliable and efficient memory performance.

Datasheet Summary
Powered by GS/AI

The IS43DR82560B-25EBL-TR is a 2Gb DDR2 SDRAM memory chip featuring a double data rate architecture that allows for high-speed operation with a 4n-prefetch design. It operates at a voltage of 1.8V ±0.1V and is compatible with JEDEC standard 1.8V I/O (SSTL_18). The device supports programmable CAS latency options of 3, 4, 5, 6, and 7, along with adjustable burst lengths of 4 or 8. It includes eight internal banks for concurrent operations and features on-die termination (ODT) for improved signal integrity. The memory chip is available in a 60-ball BGA package measuring 10.5mm x 13mm and is suitable for commercial, industrial, and automotive applications, with temperature ranges from -40°C to 105°C for automotive grades. Key timing parameters include a cycle time of 2.5ns at CL=6 for DDR2-800E and 3.0ns at CL=5 for DDR2-667D. This product is designed for applications requiring reliable and efficient memory performance.

Suppliers

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Description
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SDRAM - DDR2 Memory IC 2Gbit Parallel 400 MHz 400 ps 60-TWBGA (10.5x13)

SDRAM - DDR2 Memory IC 2Gbit Parallel 400 MHz 400 ps 60-TWBGA (10.5x13)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - IS43DR82560B-25EBL-TR - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
IS43DR82560B-25EBL-TR
Integrated Circuits (ICs) - Memory IS43DR82560B-25EBL-TR
IC DRAM 2GBIT PARALLEL 60TWBGA

IC DRAM 2GBIT PARALLEL 60TWBGA

Supplier's Site
IC DRAM 2GBIT PARALLEL 60TWBGA

IC DRAM 2GBIT PARALLEL 60TWBGA

Supplier's Site Datasheet

Technical Specifications

  Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited
Product Category Memory Chips Memory Chips Memory Chips
Product Number IS43DR82560B-25EBL-TR IS43DR82560B-25EBL-TR IS43DR82560B-25EBL-TR
Product Name Memory Integrated Circuits (ICs) - Memory Memory
Memory Category DRAM; DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip
Access Time 0.4000 ns 0.4000 ns 0.4000 ns
Operating Temperature -40 to 85 C (-40 to 185 F) -40 to 85 C (-40 to 185 F)
Density 2000000 kbits 2000000 kbits 2000000 kbits
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