Integrated Device Technology 3.3V 256K x 36 Synchronous 2.5V I/O PipeLined SRAM 71V67602S166PFG

Description
The 71V67602 3.3V CMOS SRAM is organized as 256K x 36. The 71V676 SRAM contains write, data, address and control registers. Internal logic allows the SRAM to generate a self-timed write based upon a decision which can be left until the end of the write cycle. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM .
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Description
The 71V67602 3.3V CMOS SRAM is organized as 256K x 36. The 71V676 SRAM contains write, data, address and control registers. Internal logic allows the SRAM to generate a self-timed write based upon a decision which can be left until the end of the write cycle. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM .
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Suppliers

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Product
Description
Supplier Links
3.3V 256K x 36 Synchronous 2.5V I/O PipeLined SRAM - 71V67602S166PFG - Integrated Device Technology
San Jose, CA, USA
3.3V 256K x 36 Synchronous 2.5V I/O PipeLined SRAM
71V67602S166PFG
3.3V 256K x 36 Synchronous 2.5V I/O PipeLined SRAM 71V67602S166PFG
The 71V67602 3.3V CMOS SRAM is organized as 256K x 36. The 71V676 SRAM contains write, data, address and control registers. Internal logic allows the SRAM to generate a self-timed write based upon a decision which can be left until the end of the write cycle. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM .

The 71V67602 3.3V CMOS SRAM is organized as 256K x 36. The 71V676 SRAM contains write, data, address and control registers. Internal logic allows the SRAM to generate a self-timed write based upon a decision which can be left until the end of the write cycle. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM .

Supplier's Site Datasheet
 - 71V67602S166PFG - Rochester Electronics
Newburyport, MA, United States
256K X 36 3.3V Synchronous SRAM 3.3V I/O, Burst Counter Pipelined Outputs, Single Cycle Deselect

256K X 36 3.3V Synchronous SRAM 3.3V I/O, Burst Counter Pipelined Outputs, Single Cycle Deselect

Supplier's Site Datasheet
Integrated Circuits (ICs) - Memory - Memory - 71V67602S166PFG - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Memory
71V67602S166PFG
Integrated Circuits (ICs) - Memory - Memory 71V67602S166PFG
IC SRAM 9MBIT PARALLEL 100TQFP

IC SRAM 9MBIT PARALLEL 100TQFP

Supplier's Site
Memory - 71V67602S166PFG - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SRAM - Synchronous, SDR Memory IC 9Mbit Parallel 166 MHz 3.5 ns 100-TQFP (14x14)

SRAM - Synchronous, SDR Memory IC 9Mbit Parallel 166 MHz 3.5 ns 100-TQFP (14x14)

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Technical Specifications

  Integrated Device Technology Rochester Electronics Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 71V67602S166PFG 71V67602S166PFG 71V67602S166PFG 71V67602S166PFG
Product Name 3.3V 256K x 36 Synchronous 2.5V I/O PipeLined SRAM Integrated Circuits (ICs) - Memory - Memory Memory
Memory Category SRAM Chip SRAM Chip Volatile; SRAM Chip SRAM; SRAM Chip
Data Rate 166 MHz 166 MHz
Operating Temperature 0 to 70 C (32 to 158 F) 0 to 70 C (32 to 158 F)
Density 256 kbits 9000 kbits 9000 kbits
Number of Words 256 k
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