Integra Technologies, Inc. GaN UHF Transistor IGN450M160

Description
■ GaN on SiC HEMT Technology ■ POUT-PK ≥ 160W @ 100us/10%/50V ■ 420 to 450 Operating Frequency ■ Internal Input Impedance Pre-matched Device ■ No Internal Output Match for Efficiency Optimization ■ Depletion Mode Device - Negative Gate Voltage and Bias Sequencing Required ■ Specified For Use Under Class AB Operation ■ Metal Based Package Sealed With Ceramic-Epoxy Lid ■ Gold Metallization System: Chip - Wire Bond - Package ■ Package Size: W=0.800′ (40.60mm), L=0.400′ (20.30mm) ■ 100% High Power RF Tested in Fixed Tuned RF Test Fixture
Description
■ GaN on SiC HEMT Technology ■ POUT-PK ≥ 160W @ 100us/10%/50V ■ 420 to 450 Operating Frequency ■ Internal Input Impedance Pre-matched Device ■ No Internal Output Match for Efficiency Optimization ■ Depletion Mode Device - Negative Gate Voltage and Bias Sequencing Required ■ Specified For Use Under Class AB Operation ■ Metal Based Package Sealed With Ceramic-Epoxy Lid ■ Gold Metallization System: Chip - Wire Bond - Package ■ Package Size: W=0.800′ (40.60mm), L=0.400′ (20.30mm) ■ 100% High Power RF Tested in Fixed Tuned RF Test Fixture

Suppliers

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Description
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GaN UHF Transistor - IGN450M160 - Integra Technologies, Inc.
El Segundo, CA, USA
GaN UHF Transistor
IGN450M160
GaN UHF Transistor IGN450M160
■ GaN on SiC HEMT Technology ■ POUT-PK ≥ 160W @ 100us/10%/50V ■ 420 to 450 Operating Frequency ■ Internal Input Impedance Pre-matched Device ■ No Internal Output Match for Efficiency Optimization ■ Depletion Mode Device - Negative Gate Voltage and Bias Sequencing Required ■ Specified For Use Under Class AB Operation ■ Metal Based Package Sealed With Ceramic-Epoxy Lid ■ Gold Metallization System: Chip - Wire Bond - Package ■ Package Size: W=0.800′ (40.60mm), L=0.400′ (20.30mm) ■ 100% High Power RF Tested in Fixed Tuned RF Test Fixture

■ GaN on SiC HEMT Technology
■ POUT-PK ≥ 160W @ 100us/10%/50V
■ 420 to 450 Operating Frequency
■ Internal Input Impedance Pre-matched Device
■ No Internal Output Match for Efficiency Optimization
■ Depletion Mode Device - Negative Gate Voltage and Bias Sequencing Required
■ Specified For Use Under Class AB Operation
■ Metal Based Package Sealed With Ceramic-Epoxy Lid
■ Gold Metallization System: Chip - Wire Bond - Package
■ Package Size: W=0.800″ (40.60mm), L=0.400″ (20.30mm)
■ 100% High Power RF Tested in Fixed Tuned RF Test Fixture

Supplier's Site

Technical Specifications

  Integra Technologies, Inc.
Product Category RF MOSFET Transistors
Product Number IGN450M160
Product Name GaN UHF Transistor
Transistor Technology / Material GaN
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