Integra Technologies, Inc. GaN L-Band Avionics Transistor IGN1012S1000

Description
■ GaN on SiC HEMT Technology ■ POUT-PK = 1000W @ 32us/2% / 50V ■ 1.025-1.150GHz Instantaneous Operating Frequency Range ■ Internal Impedance Pre-matched Device ■ Depletion Mode Device ■ Negative Gate Voltage and Bias Sequencing Required ■ Specified For Use Under Class AB Operation ■ Metal Based Package Sealed With Ceramic-Epoxy Lid ■ Gold Metallization System: Chip - Wire Bond - Package ■ Package Size: W=1.340′ (34.04mm), L=0.385′ (9.78mm) ■ 100% High Power RF Tested in Fixed Tuned RF Test Fixture
Description
■ GaN on SiC HEMT Technology ■ POUT-PK = 1000W @ 32us/2% / 50V ■ 1.025-1.150GHz Instantaneous Operating Frequency Range ■ Internal Impedance Pre-matched Device ■ Depletion Mode Device ■ Negative Gate Voltage and Bias Sequencing Required ■ Specified For Use Under Class AB Operation ■ Metal Based Package Sealed With Ceramic-Epoxy Lid ■ Gold Metallization System: Chip - Wire Bond - Package ■ Package Size: W=1.340′ (34.04mm), L=0.385′ (9.78mm) ■ 100% High Power RF Tested in Fixed Tuned RF Test Fixture

Suppliers

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GaN L-Band Avionics Transistor - IGN1012S1000 - Integra Technologies, Inc.
El Segundo, CA, USA
GaN L-Band Avionics Transistor
IGN1012S1000
GaN L-Band Avionics Transistor IGN1012S1000
■ GaN on SiC HEMT Technology ■ POUT-PK = 1000W @ 32us/2% / 50V ■ 1.025-1.150GHz Instantaneous Operating Frequency Range ■ Internal Impedance Pre-matched Device ■ Depletion Mode Device ■ Negative Gate Voltage and Bias Sequencing Required ■ Specified For Use Under Class AB Operation ■ Metal Based Package Sealed With Ceramic-Epoxy Lid ■ Gold Metallization System: Chip - Wire Bond - Package ■ Package Size: W=1.340′ (34.04mm), L=0.385′ (9.78mm) ■ 100% High Power RF Tested in Fixed Tuned RF Test Fixture

■ GaN on SiC HEMT Technology
■ POUT-PK = 1000W @ 32us/2% / 50V
■ 1.025-1.150GHz Instantaneous Operating Frequency Range
■ Internal Impedance Pre-matched Device
■ Depletion Mode Device
■ Negative Gate Voltage and Bias Sequencing Required
■ Specified For Use Under Class AB Operation
■ Metal Based Package Sealed With Ceramic-Epoxy Lid
■ Gold Metallization System: Chip - Wire Bond - Package
■ Package Size: W=1.340″ (34.04mm), L=0.385″ (9.78mm)
■ 100% High Power RF Tested in Fixed Tuned RF Test Fixture

Supplier's Site

Technical Specifications

  Integra Technologies, Inc.
Product Category RF MOSFET Transistors
Product Number IGN1012S1000
Product Name GaN L-Band Avionics Transistor
Transistor Technology / Material GaN
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