Integra Technologies, Inc. GaN L-Band Avionics Transistor IGN1011L1200

Description
■ GEN-2 GaN on SiC HEMT Technology ■ POUT-PK = 1200W @ ELM Mode S / 6.4% / 50V OR 2.4ms, 6.4% DC / 50V ■ 1.030GHz and 1.090GHz Operating Frequency ■ Internal Impedance Pre-matched Device ■ Depletion Mode Device ■ Negative Gate Voltage and Bias Sequencing Required ■ Specified For Use Under Class AB Operation ■ Metal Based Package Sealed With Ceramic-Epoxy Lid ■ Gold Metallization System: Chip - Wire Bond - Package ■ Package Size: W=1.340′ (34.04mm), L=0.385′ (9.78mm) ■ 100% High Power RF Tested in Fixed Tuned RF Test Fixture
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Description
■ GEN-2 GaN on SiC HEMT Technology ■ POUT-PK = 1200W @ ELM Mode S / 6.4% / 50V OR 2.4ms, 6.4% DC / 50V ■ 1.030GHz and 1.090GHz Operating Frequency ■ Internal Impedance Pre-matched Device ■ Depletion Mode Device ■ Negative Gate Voltage and Bias Sequencing Required ■ Specified For Use Under Class AB Operation ■ Metal Based Package Sealed With Ceramic-Epoxy Lid ■ Gold Metallization System: Chip - Wire Bond - Package ■ Package Size: W=1.340′ (34.04mm), L=0.385′ (9.78mm) ■ 100% High Power RF Tested in Fixed Tuned RF Test Fixture
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Suppliers

Company
Product
Description
Supplier Links
GaN L-Band Avionics Transistor - IGN1011L1200 - Integra Technologies, Inc.
El Segundo, CA, USA
GaN L-Band Avionics Transistor
IGN1011L1200
GaN L-Band Avionics Transistor IGN1011L1200
■ GEN-2 GaN on SiC HEMT Technology ■ POUT-PK = 1200W @ ELM Mode S / 6.4% / 50V OR 2.4ms, 6.4% DC / 50V ■ 1.030GHz and 1.090GHz Operating Frequency ■ Internal Impedance Pre-matched Device ■ Depletion Mode Device ■ Negative Gate Voltage and Bias Sequencing Required ■ Specified For Use Under Class AB Operation ■ Metal Based Package Sealed With Ceramic-Epoxy Lid ■ Gold Metallization System: Chip - Wire Bond - Package ■ Package Size: W=1.340′ (34.04mm), L=0.385′ (9.78mm) ■ 100% High Power RF Tested in Fixed Tuned RF Test Fixture

■ GEN-2 GaN on SiC HEMT Technology
■ POUT-PK = 1200W @ ELM Mode S / 6.4% / 50V OR 2.4ms,
6.4% DC / 50V
■ 1.030GHz and 1.090GHz Operating Frequency
■ Internal Impedance Pre-matched Device
■ Depletion Mode Device
■ Negative Gate Voltage and Bias Sequencing Required
■ Specified For Use Under Class AB Operation
■ Metal Based Package Sealed With Ceramic-Epoxy Lid
■ Gold Metallization System: Chip - Wire Bond - Package
■ Package Size: W=1.340″ (34.04mm), L=0.385″ (9.78mm)
■ 100% High Power RF Tested in Fixed Tuned RF Test Fixture

Supplier's Site
RF FETs, MOSFETs - 2251-IGN1011L1200-ND - DigiKey
Thief River Falls, MN, United States
RF FETs, MOSFETs
2251-IGN1011L1200-ND
RF FETs, MOSFETs 2251-IGN1011L1200-ND
RF Mosfet HEMT 50V 160mA 1.03GHz ~ 1.09GHz 16.8dB 1250W PL84A1

RF Mosfet HEMT 50V 160mA 1.03GHz ~ 1.09GHz 16.8dB 1250W PL84A1

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Technical Specifications

  Integra Technologies, Inc. DigiKey
Product Category RF MOSFET Transistors Transistors
Product Number IGN1011L1200 2251-IGN1011L1200-ND
Product Name GaN L-Band Avionics Transistor RF FETs, MOSFETs
Transistor Technology / Material GaN
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