S-COM8.4 dual interface module with inductive coupling and 6 CB contacts
The innovative ’Coil on Module’ package technology from Infineon uses a radiofrequency link rather than the common mechanical-electrica
l connection between the card antenna and the module, it employs two antennas, one on the module and one in the card, communicating w/o physical electrical connection.It improves the robustness of dual interface cards and simplifies card design and manufacturing, making it more efficient and faster.’Coil on Module’ underlines our technology leadership and is based on our extensive semiconductor and module expertise as well as profound understanding of card manufacturer’s
Summary of Features
Pitch: 9.5 mm
Dimensions: 11 x 8.3 mm
Thikcness: max. 420µm
Contact surface NiAu
Derivates: Au surface, Pd surface
ISO 7816-1, ISO 7810, ISO 10373-1/-3
Tape on Reel
S-COM8.4 dual interface module with inductive coupling and 6 CB contacts
The innovative ’Coil on Module’ package technology from Infineon uses a radiofrequency link rather than the common mechanical-electrical connection between the card antenna and the module, it employs two antennas, one on the module and one in the card, communicating w/o physical electrical connection.It improves the robustness of dual interface cards and simplifies card design and manufacturing, making it more efficient and faster.’Coil on Module’ underlines our technology leadership and is based on our extensive semiconductor and module expertise as well as profound understanding of card manufacturer’s
Summary of Features
- Pitch: 9.5 mm
- Dimensions: 11 x 8.3 mm
- Thikcness: max. 420µm
- Contact surface NiAu
- Derivates: Au surface, Pd surface
- ISO 7816-1, ISO 7810, ISO 10373-1/-3
- Tape on Reel
