Infineon Technologies AG Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Discretes - IMT65R072M1H IMT65R072M1H

Description
Small footprint, low inductance and reduced thermal impedance for high density designs CoolSIC™ MOSFET 650 V, 72 mΩ in TOLL package leverages the strengths of the Infineon SiC technology to enable higher density designs and higher switching frequency operations. The small form factor and low parasitic of TOLL allow for an efficient and effective usage of board space as well to drive the MOSFET at higher frequencies, reaching higher power density. CoolSIC™ MOSFET 650 V, 72 mΩ in TOLL package offering is complemented by the availability of TOLL also for CoolMOS™ and CoolGaN™, making it an appealing one stop shop option for various systems. The reduction of thermal impedance compared to D²PAK, together with the innovative .XT interconnect, makes the 72 mΩ product suitable for high to mid power systems. It ideally fits the emerging Totem Pole PFC topology in high to mid power systems. It also enables high efficiency and density in DC-DC and AC-DC stages. It is also successfully used in interleaved topologies to address high efficiency targets in high power systems. Summary of Features Small form factor Low parasitic inductance and Kelvin source connection Reduced thermal impedance .XT interconnect Thermal improvement over D²PAK and similar to TO-220 Suitable for wave or reflow soldering Industry standard package - JEDEC industrial applications qualified (J-STD20 and JESD22) Benefits Enable high system power density and high switching operations Enable cheaper and faster SMD assembly Ease of use and compatibility with existing vendors Reduced switching losses Lower case temperature and higher reliability Enables easy design-in with complementing Infineon products like CoolMOS™ and CoolGaN™ Potential Applications Datacenter Power Telecom power Solar Inverters Energy storage systems Battery formation Industrial SMPS Motor drives Online UPS
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Description
Small footprint, low inductance and reduced thermal impedance for high density designs CoolSIC™ MOSFET 650 V, 72 mΩ in TOLL package leverages the strengths of the Infineon SiC technology to enable higher density designs and higher switching frequency operations. The small form factor and low parasitic of TOLL allow for an efficient and effective usage of board space as well to drive the MOSFET at higher frequencies, reaching higher power density. CoolSIC™ MOSFET 650 V, 72 mΩ in TOLL package offering is complemented by the availability of TOLL also for CoolMOS™ and CoolGaN™, making it an appealing one stop shop option for various systems. The reduction of thermal impedance compared to D²PAK, together with the innovative .XT interconnect, makes the 72 mΩ product suitable for high to mid power systems. It ideally fits the emerging Totem Pole PFC topology in high to mid power systems. It also enables high efficiency and density in DC-DC and AC-DC stages. It is also successfully used in interleaved topologies to address high efficiency targets in high power systems. Summary of Features Small form factor Low parasitic inductance and Kelvin source connection Reduced thermal impedance .XT interconnect Thermal improvement over D²PAK and similar to TO-220 Suitable for wave or reflow soldering Industry standard package - JEDEC industrial applications qualified (J-STD20 and JESD22) Benefits Enable high system power density and high switching operations Enable cheaper and faster SMD assembly Ease of use and compatibility with existing vendors Reduced switching losses Lower case temperature and higher reliability Enables easy design-in with complementing Infineon products like CoolMOS™ and CoolGaN™ Potential Applications Datacenter Power Telecom power Solar Inverters Energy storage systems Battery formation Industrial SMPS Motor drives Online UPS
Request a Quote
Datasheet
Datasheet Summary
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The IMT65R072M1H is a 650 V silicon carbide MOSFET in a PG-HSOF-8 package, designed for high-efficiency power conversion applications such as SMPS, UPS, solar inverters, and EV charging. It features a typical on-resistance of 72 mΩ, a maximum drain current of 69 A, and a gate charge of 22 nC. The device includes a Kelvin source connection to reduce switching losses and is rated for a maximum junction temperature of 175°C. Fully qualified according to JEDEC for industrial applications, it supports standard gate drivers and offers enhanced avalanche capability and commutation robustness.

Datasheet Summary
Powered by GS/AI

The IMT65R072M1H is a 650 V silicon carbide MOSFET in a PG-HSOF-8 package, designed for high-efficiency power conversion applications such as SMPS, UPS, solar inverters, and EV charging. It features a typical on-resistance of 72 mΩ, a maximum drain current of 69 A, and a gate charge of 22 nC. The device includes a Kelvin source connection to reduce switching losses and is rated for a maximum junction temperature of 175°C. Fully qualified according to JEDEC for industrial applications, it supports standard gate drivers and offers enhanced avalanche capability and commutation robustness.

Suppliers

Company
Product
Description
Supplier Links
Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Discretes - IMT65R072M1H - IMT65R072M1H - Infineon Technologies AG
Neubiberg, Germany
Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Discretes - IMT65R072M1H
IMT65R072M1H
Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Discretes - IMT65R072M1H IMT65R072M1H
Small footprint, low inductance and reduced thermal impedance for high density designs CoolSIC™ MOSFET 650 V, 72 mΩ in TOLL package leverages the strengths of the Infineon SiC technology to enable higher density designs and higher switching frequency operations. The small form factor and low parasitic of TOLL allow for an efficient and effective usage of board space as well to drive the MOSFET at higher frequencies, reaching higher power density. CoolSIC™ MOSFET 650 V, 72 mΩ in TOLL package offering is complemented by the availability of TOLL also for CoolMOS™ and CoolGaN™, making it an appealing one stop shop option for various systems. The reduction of thermal impedance compared to D²PAK, together with the innovative .XT interconnect, makes the 72 mΩ product suitable for high to mid power systems. It ideally fits the emerging Totem Pole PFC topology in high to mid power systems. It also enables high efficiency and density in DC-DC and AC-DC stages. It is also successfully used in interleaved topologies to address high efficiency targets in high power systems. Summary of Features Small form factor Low parasitic inductance and Kelvin source connection Reduced thermal impedance .XT interconnect Thermal improvement over D²PAK and similar to TO-220 Suitable for wave or reflow soldering Industry standard package - JEDEC industrial applications qualified (J-STD20 and JESD22) Benefits Enable high system power density and high switching operations Enable cheaper and faster SMD assembly Ease of use and compatibility with existing vendors Reduced switching losses Lower case temperature and higher reliability Enables easy design-in with complementing Infineon products like CoolMOS™ and CoolGaN™ Potential Applications Datacenter Power Telecom power Solar Inverters Energy storage systems Battery formation Industrial SMPS Motor drives Online UPS

Small footprint, low inductance and reduced thermal impedance for high density designs

CoolSIC™ MOSFET 650 V, 72 mΩ in TOLL package leverages the strengths of the Infineon SiC technology to enable higher density designs and higher switching frequency operations. The small form factor and low parasitic of TOLL allow for an efficient and effective usage of board space as well to drive the MOSFET at higher frequencies, reaching higher power density. CoolSIC™ MOSFET 650 V, 72 mΩ in TOLL package offering is complemented by the availability of TOLL also for CoolMOS™ and CoolGaN™, making it an appealing one stop shop option for various systems. The reduction of thermal impedance compared to D²PAK, together with the innovative .XT interconnect, makes the 72 mΩ product suitable for high to mid power systems. It ideally fits the emerging Totem Pole PFC topology in high to mid power systems. It also enables high efficiency and density in DC-DC and AC-DC stages. It is also successfully used in interleaved topologies to address high efficiency targets in high power systems.


Summary of Features

  • Small form factor
  • Low parasitic inductance and Kelvin source connection
  • Reduced thermal impedance
  • .XT interconnect
  • Thermal improvement over D²PAK and similar to TO-220
  • Suitable for wave or reflow soldering
  • Industry standard package - JEDEC industrial applications qualified (J-STD20 and JESD22)

Benefits

  • Enable high system power density and high switching operations
  • Enable cheaper and faster SMD assembly
  • Ease of use and compatibility with existing vendors
  • Reduced switching losses
  • Lower case temperature and higher reliability
  • Enables easy design-in with complementing Infineon products like CoolMOS™ and CoolGaN™

Potential Applications

  • Datacenter Power
  • Telecom power
  • Solar Inverters
  • Energy storage systems
  • Battery formation
  • Industrial SMPS
  • Motor drives
  • Online UPS
Supplier's Site Datasheet

Technical Specifications

  Infineon Technologies AG
Product Category Metal-Oxide Semiconductor FET (MOSFET)
Product Number IMT65R072M1H
Product Name Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Discretes - IMT65R072M1H
Polarity N-Channel; N
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