Infineon Technologies AG Sensor technology - MEMS microphones - MEMS microphones for consumer - IM73A135 IM73A135

Description
Infineon’s XENSIV™ MEMS analog microphone IM73A135 sets a new performance benchmark in MEMS microphones. A best-in-class signal to noise ratio (SNR) of 73 dB and a high acoustic overload point of 135 dBSPL enable clear audio pick up of the quietest and the loudest sounds. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The IM73A135 allows designers to reach a level of high audio performance that was previously only achievable by ECMs while at the same time reaping the benefits inherent in MEMS technology. Summary of Features Ultra-low self-noise / ultra-high SNR (73 dB) Selectable power modes for battery critical applications (170/70 µA) Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level Ultra high dynamic range and very high acoustic overload point (AOP) of 135 dBSPL Very tight part-to-part phase and sensitivity matching (± 1 dB) Flat frequency response with a very low LFRO (low frequency roll-off) of 20Hz Ultra-low group delay (2µs @ 1kHz) Benefits Crystal clear audio pick up of the quietest and the loudest sounds High ingress protection (IP57) at a microphone level Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming) Potential Applications ANC Headphones Conference systems Smart speaker Surveillance Cameras Applications Mobile devices and smartphones Security Camera and Video Doorbell Smart speaker designs
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Sensor technology - MEMS microphones - MEMS microphones for consumer - IM73A135 - IM73A135 - Infineon Technologies AG
Neubiberg, Germany
Sensor technology - MEMS microphones - MEMS microphones for consumer - IM73A135
IM73A135
Sensor technology - MEMS microphones - MEMS microphones for consumer - IM73A135 IM73A135
Infineon’s XENSIV™ MEMS analog microphone IM73A135 sets a new performance benchmark in MEMS microphones. A best-in-class signal to noise ratio (SNR) of 73 dB and a high acoustic overload point of 135 dBSPL enable clear audio pick up of the quietest and the loudest sounds. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The IM73A135 allows designers to reach a level of high audio performance that was previously only achievable by ECMs while at the same time reaping the benefits inherent in MEMS technology. Summary of Features Ultra-low self-noise / ultra-high SNR (73 dB) Selectable power modes for battery critical applications (170/70 µA) Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level Ultra high dynamic range and very high acoustic overload point (AOP) of 135 dBSPL Very tight part-to-part phase and sensitivity matching (± 1 dB) Flat frequency response with a very low LFRO (low frequency roll-off) of 20Hz Ultra-low group delay (2µs @ 1kHz) Benefits Crystal clear audio pick up of the quietest and the loudest sounds High ingress protection (IP57) at a microphone level Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming) Potential Applications ANC Headphones Conference systems Smart speaker Surveillance Cameras Applications Mobile devices and smartphones Security Camera and Video Doorbell Smart speaker designs

Infineon’s XENSIV™ MEMS analog microphone IM73A135 sets a new performance benchmark in MEMS microphones. A best-in-class signal to noise ratio (SNR) of 73 dB and a high acoustic overload point of 135 dBSPL enable clear audio pick up of the quietest and the loudest sounds. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The IM73A135 allows designers to reach a level of high audio performance that was previously only achievable by ECMs while at the same time reaping the benefits inherent in MEMS technology.


Summary of Features

  • Ultra-low self-noise / ultra-high SNR (73 dB)
  • Selectable power modes for battery critical applications (170/70 µA)
  • Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
  • Ultra high dynamic range and very high acoustic overload point (AOP) of 135 dBSPL
  • Very tight part-to-part phase and sensitivity matching (± 1 dB)
  • Flat frequency response with a very low LFRO (low frequency roll-off) of 20Hz
  • Ultra-low group delay (2µs @ 1kHz)

Benefits

  • Crystal clear audio pick up of the quietest and the loudest sounds
  • High ingress protection (IP57) at a microphone level
  • Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)

Potential Applications

  • ANC Headphones
  • Conference systems
  • Smart speaker
  • Surveillance
  • Cameras

Applications

  • Mobile devices and smartphones
  • Security Camera and Video Doorbell
  • Smart speaker designs
Supplier's Site Datasheet

Technical Specifications

  Infineon Technologies AG
Product Category Audio Microphones
Product Number IM73A135
Product Name Sensor technology - MEMS microphones - MEMS microphones for consumer - IM73A135
SN Ratio 73 dB
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