Infineon Technologies AG Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - FF3MR20KM1H FF3MR20KM1H

Description
62 mm CoolSiC™ MOSFET half bridge module 2000 V, 2.6 mΩ G1 in the well known 62mm housing with M1H chip technology. Also available with pre-applied Thermal Interface Material (TIM). Summary of Features High current density Low switching losses Superior gate oxide reliability Robust integrated body diode High cosmic ray robustness High speed switching module Symmetrical module design Standard construction technique Benefits Minimizes cooling efforts Reduction in volume and size Reduced system costs Improved chip performance Applications Energy Storage Systems EV charging Photovoltaic Traction Uninterruptible power supplies (UPS)
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Description
62 mm CoolSiC™ MOSFET half bridge module 2000 V, 2.6 mΩ G1 in the well known 62mm housing with M1H chip technology. Also available with pre-applied Thermal Interface Material (TIM). Summary of Features High current density Low switching losses Superior gate oxide reliability Robust integrated body diode High cosmic ray robustness High speed switching module Symmetrical module design Standard construction technique Benefits Minimizes cooling efforts Reduction in volume and size Reduced system costs Improved chip performance Applications Energy Storage Systems EV charging Photovoltaic Traction Uninterruptible power supplies (UPS)
Request a Quote
Datasheet
Datasheet Summary
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FF3MR20KM1H is a 62 mm C-series silicon carbide MOSFET half-bridge module with a 2000 V drain-source voltage rating and a continuous drain current of 375 A at 25 °C. It features an internal inductance of 20 nH, a on-resistance of 2.6 mΩ at 25 °C, and a junction-to-case thermal resistance of 0.0880 K/W. The module has a 4 kV AC 1-minute insulation voltage, 29.0 mm creepage distance between terminals and heat sink, and operates from -40 °C to 175 °C. It meets IEC 60747, IEC 60749, and IEC 60068 standards for industrial applications.

Datasheet Summary
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FF3MR20KM1H is a 62 mm C-series silicon carbide MOSFET half-bridge module with a 2000 V drain-source voltage rating and a continuous drain current of 375 A at 25 °C. It features an internal inductance of 20 nH, a on-resistance of 2.6 mΩ at 25 °C, and a junction-to-case thermal resistance of 0.0880 K/W. The module has a 4 kV AC 1-minute insulation voltage, 29.0 mm creepage distance between terminals and heat sink, and operates from -40 °C to 175 °C. It meets IEC 60747, IEC 60749, and IEC 60068 standards for industrial applications.

Suppliers

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Product
Description
Supplier Links
Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - FF3MR20KM1H - FF3MR20KM1H - Infineon Technologies AG
Neubiberg, Germany
Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - FF3MR20KM1H
FF3MR20KM1H
Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - FF3MR20KM1H FF3MR20KM1H
62 mm CoolSiC™ MOSFET half bridge module 2000 V, 2.6 mΩ G1 in the well known 62mm housing with M1H chip technology. Also available with pre-applied Thermal Interface Material (TIM). Summary of Features High current density Low switching losses Superior gate oxide reliability Robust integrated body diode High cosmic ray robustness High speed switching module Symmetrical module design Standard construction technique Benefits Minimizes cooling efforts Reduction in volume and size Reduced system costs Improved chip performance Applications Energy Storage Systems EV charging Photovoltaic Traction Uninterruptible power supplies (UPS)

62 mm CoolSiC™ MOSFET half bridge module 2000 V, 2.6 mΩ G1 in the well known 62mm housing with M1H chip technology. Also available with pre-applied Thermal Interface Material (TIM).


Summary of Features

  • High current density
  • Low switching losses
  • Superior gate oxide reliability
  • Robust integrated body diode
  • High cosmic ray robustness
  • High speed switching module
  • Symmetrical module design
  • Standard construction technique

Benefits

  • Minimizes cooling efforts
  • Reduction in volume and size
  • Reduced system costs
  • Improved chip performance

Applications

  • Energy Storage Systems
  • EV charging
  • Photovoltaic
  • Traction
  • Uninterruptible power supplies (UPS)
Supplier's Site Datasheet

Technical Specifications

  Infineon Technologies AG
Product Category Metal-Oxide Semiconductor FET (MOSFET)
Product Number FF3MR20KM1H
Product Name Power - MOSFET (Si/SiC) - Silicon Carbide CoolSiC™ MOSFET - Silicon Carbide MOSFET Modules - FF3MR20KM1H
Transistor Technology / Material Silicon carbide
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