62 mm CoolSiC™ MOSFET half bridge module 2000 V, 2.6 mΩ G1 in the well known 62mm housing with M1H chip technology. Also available with pre-applied Thermal Interface Material (TIM).
Summary of Features
High current density
Low switching losses
Superior gate oxide reliability
Robust integrated body diode
High cosmic ray robustness
High speed switching module
Symmetrical module design
Standard construction technique
Benefits
Minimizes cooling efforts
Reduction in volume and size
Reduced system costs
Improved chip performance
Applications
Energy Storage Systems
EV charging
Photovoltaic
Traction
Uninterruptible power supplies (UPS)
62 mm CoolSiC™ MOSFET half bridge module 2000 V, 2.6 mΩ G1 in the well known 62mm housing with M1H chip technology. Also available with pre-applied Thermal Interface Material (TIM).
Summary of Features
- High current density
- Low switching losses
- Superior gate oxide reliability
- Robust integrated body diode
- High cosmic ray robustness
- High speed switching module
- Symmetrical module design
- Standard construction technique
Benefits
- Minimizes cooling efforts
- Reduction in volume and size
- Reduced system costs
- Improved chip performance
Applications
- Energy Storage Systems
- EV charging
- Photovoltaic
- Traction
- Uninterruptible power supplies (UPS)