Illinois Tool Works Inc. Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 25-7070-6411 - 4 lb - 0.062 in Wire Diameter - Sn/Ag Compound 25-7070-6411

Description
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is sn95/ag05.
Description
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is sn95/ag05.

Suppliers

Company
Product
Description
Supplier Links
Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 25-7070-6411 - 4 lb - 0.062 in Wire Diameter - Sn/Ag Compound - 25-7070-6411 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 25-7070-6411 - 4 lb - 0.062 in Wire Diameter - Sn/Ag Compound
25-7070-6411
Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 25-7070-6411 - 4 lb - 0.062 in Wire Diameter - Sn/Ag Compound 25-7070-6411
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is sn95/ag05.

The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is sn95/ag05.

Buy Now

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Filler Alloys and Consumables
Product Number 25-7070-6411
Product Name Kester 331 Water Soluble Flux Core Lead-Free Solder Wire 25-7070-6411 - 4 lb - 0.062 in Wire Diameter - Sn/Ag Compound
Joining Process / Product Form Solid wire or rod
Unlock Full Specs
to access all available technical data

Similar Products

Solder - 2349592 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0472 inch (1.2 mm)
Melting Range 370 F (188 C)
View Details
ALPHA ® SF828-MBB Liquid Soldering Flux -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Fluxes & Cleaners Soldering Flux / Rosin
View Details
Nickel Pre-Cut Tabs -  - Sunstone Engineering
Sunstone Engineering
Specs
Joining Process / Product Form Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
Welding Filler Types Nickel Alloy
View Details
Welding Consumable - Submerged Arc - Lincolnweld®  L-70 - Lincoln Electric Co. (The)
Specs
Joining Process / Product Form Submerged Arc (SAW) Electrode
Diameter / Thickness 0.0781 to 0.1875 inch (1.98 to 4.76 mm)
Nominal Composition 0.05-0.15 %C, 0.65-1.00 %Mn, 0.20 %Si, 0.45-0.65 %Mo, 0.025 %S, 0.025 %P, 0.35 %Cu
View Details