Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 18 AWG, 19 SWG Spool, 1 lb (454 g)
The Kester 275 no clean flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +700 F. It's manufactured as a no clean flux core. Total composition for this no clean flux core lead-free solder wire is sn96.5/ag03/cu0.5.
| DigiKey | R. S. Hughes Company, Inc. | |
|---|---|---|
| Product Category | Filler Alloys and Consumables | Filler Alloys and Consumables |
| Product Number | 24-7068-7605-ND | 24-7068-7605 |
| Product Name | Solder | Kester 275 No Clean Flux Core Lead-Free Solder Wire 24-7068-7605 - 1 lb - 0.04 in Wire Diameter - Sn/Ag/Cu Compound |
| Joining Process / Product Form | Solid wire or rod; Spool, 1 lb (454 g) | Solid wire or rod |
