MacDermid Alpha Electronics Solutions Solder Paste Materials for Printed Circuit Boards (PCB) ALPHA ® OM-377 Solder Paste

Product Overview ALPHA OM-377 is a lead-free, no-clean solder paste engineered for superior electrochemical reliability in fine-pitch, low-standoff SMT assemblies. Optimized for high-density PCB applications and ultra-miniaturized components down to 01005, it delivers excellent solderability, low post-reflow residue, and >1.33 Cpk transfer efficiency on fine-feature pads as small as 100 µm x 150 µm. With outstanding Head-in-Pillow (HiP) and Non-Wet Open (NWO) performance, ALPHA OM-377 is ideal for mobile, wearable, and advanced electronic assemblies requiring smaller, thinner, and lighter form factors. Product Features Enables Complex Miniaturized Assemblies Superior print and reflow performance combined with ultra-fine powder technology to support complex miniaturized SMT assembly applications. Excellent HiP and NWO Performance Improves first-pass yield with exceptional resistance to warpage-induced Head-in-Pillow (HiP) and Non-Wet Open (NWO) defects on high I/O packages. Robust Electrochemical Reliability Maintains board-level electrochemical reliability on fine-pitch, low-standoff packages under stringent operating and harsh environmental conditions. Enhanced Solderability Enables excellent wettability and strong solder joint integrity on hard-to-wet brass and nickel surfaces. Minimal Post-Reflow Residue Significantly reduces post-reflow residue to help mitigate material compatibility concerns in high-density PCB assemblies.