Leaded No-Clean Wire Solder Sn63Pb37 (63/37) 20 AWG, 22 SWG Spool, 1 lb (454 g)
No-Clean Cored Solder Wire, Sn63Pb37 Alloy, 1 lbs. Weight
Leaves a low amount of residue, which is both visually negligible and electrically safe. Does not require cleaning, is environmentally safe and needs no CFC solvents.
Kester in.245in. low residue flux for cored solder wire was developed to complement the newer generations of low residue liquid fluxes being used by the electronics industry. The use of in.245in. low residue flux results in visually acceptable assemblies
The Kester 245 lead solder wire is another quality product from Kester. Melting point is reached at a temperature of +363 F. It's manufactured as an activated rosin flux core. Total composition for this lead solder wire is sn63/pb37. Additional, and potentially important, information was collected about this product: Flux Size: 58
| DigiKey | Allied Electronics, Inc. | R. S. Hughes Company, Inc. | |
|---|---|---|---|
| Product Category | Filler Alloys and Consumables | Filler Alloys and Consumables | Filler Alloys and Consumables |
| Product Number | KE1408-ND | 70177939 | 24-6337-8801 |
| Product Name | Solder | Solder Wire; halide-free rosin no-cleanflux; Sn63Pb37; .031 dia; core 58; 1 lb | Kester 245 Lead Solder Wire 24-6337-8801 - 1 lb - 0.031 in Wire Diameter - Sn/Pb Compound |
| Joining Process / Product Form | Solid wire or rod; Spool, 1 lb (454 g) | Solid wire or rod | Solid wire or rod |
| Nominal Composition | Sn63Pb37 (63/37) | Sn63Pb37 | |
| Melting Range | 361 F (183 C) |
