Product Overview
With proven reliability in Electric Vehicle (EV) and rail traction applications, ALPHA Argomax 5022 Paste is specifically designed for low-pressure sintering die attachment on dried paste applied to copper-finished Direct Bonded Copper (DBC) substrates. It is formulated with proprietary engineered silver particles to support reliable attachment to standard DBC without the need for gold or silver surface finishes.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | ALPHA ® Argomax ® 5022 Paste |
| Product Name | Silver Sintering Package Attach for Semiconductor Power Modules |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
