Features exceptionally low bleed and evaporation characteristics. Will not harden, dry out or melt; will not contaminate wave and solder baths. Meets or exceeds KS 21343 and MIL-C-47113. Use with both metal and plastic.
SILICONE FREE HEAT SINK, 1LB; Dispensing Method:Tub; Volume:-; Weight:1lb; Product Range:- RoHS Compliant: Yes
Allied Electronics, Inc. | Newark, An Avnet Company | |
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Product Category | Thermal Compounds and Thermal Interface Materials | Thermal Compounds and Thermal Interface Materials |
Product Number | 70207177 | 92B2685 |
Product Name | Chemical,Heat Sink Comp,1 lb,Silicone Free,Jar | Silicone Free Heat Sink, 1Lb; Dispensing Method Techspray |
Form / Shape | Grease, Paste |