Techspray, an ITW Company Chemical,Heat Sink Comp,1 lb,Silicone Free,Jar 1978-1

Datasheet

Suppliers

Company
Product
Description
Supplier Links
Chemical,Heat Sink Comp,1 lb,Silicone Free,Jar - 70207177 - Allied Electronics, Inc.
Fort Worth, TX, USA
Chemical,Heat Sink Comp,1 lb,Silicone Free,Jar
70207177
Chemical,Heat Sink Comp,1 lb,Silicone Free,Jar 70207177
Features exceptionally low bleed and evaporation characteristics. Will not harden, dry out or melt; will not contaminate wave and solder baths. Meets or exceeds KS 21343 and MIL-C-47113. Use with both metal and plastic. Ideal for Electronic Applications Avoids Silicone Contamination for Soldering

Features exceptionally low bleed and evaporation characteristics. Will not harden, dry out or melt; will not contaminate wave and solder baths. Meets or exceeds KS 21343 and MIL-C-47113. Use with both metal and plastic.

  • Ideal for Electronic Applications
  • Avoids Silicone Contamination for Soldering
Supplier's Site
Silicone Free Heat Sink, 1Lb; Dispensing Method Techspray - 92B2685 - Newark, An Avnet Company
Chicago, IL, United States
Silicone Free Heat Sink, 1Lb; Dispensing Method Techspray
92B2685
Silicone Free Heat Sink, 1Lb; Dispensing Method Techspray 92B2685
SILICONE FREE HEAT SINK, 1LB; Dispensing Method:Tub; Volume:-; Weight:1lb; Product Range:- RoHS Compliant: Yes

SILICONE FREE HEAT SINK, 1LB; Dispensing Method:Tub; Volume:-; Weight:1lb; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Allied Electronics, Inc. Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials Thermal Compounds and Thermal Interface Materials
Product Number 70207177 92B2685
Product Name Chemical,Heat Sink Comp,1 lb,Silicone Free,Jar Silicone Free Heat Sink, 1Lb; Dispensing Method Techspray
Form / Shape Grease, Paste
Unlock Full Specs
to access all available technical data

Similar Products

Non-Silicone Thermal Conductive Pad - N700B - Shiu Li Technology Co., Ltd
Specs
Type / Form Sheet or Film
Features Thermally Conductive; UL Rating
Industry Electronics
View Details
One Component, High Temperature Resistant Epoxy - EP36 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Thermal Gap Filler - GF400 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Air Setting / Film Drying; Thermoset; Two Component  
Type / Form Liquid
Chemical System Silicone
View Details
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Features Flame Retardant; Thermally Conductive; UL Rating
View Details