Techspray, an ITW Company Heat Sink Compound, Tube, 4Oz; Dispensing Method Techspray 1977-DP

Description
HEAT SINK COMPOUND, TUBE, 4OZ; Dispensing Method:Tube; Volume:-; Weight:4oz; Product Range:-; Coating Applications:Heat Sinks, Power Transistors; Coating Type:Conductive; Colour:White RoHS Compliant: Yes
Datasheet
Description
HEAT SINK COMPOUND, TUBE, 4OZ; Dispensing Method:Tube; Volume:-; Weight:4oz; Product Range:-; Coating Applications:Heat Sinks, Power Transistors; Coating Type:Conductive; Colour:White RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Heat Sink Compound, Tube, 4Oz; Dispensing Method Techspray - 69K8373 - Newark, An Avnet Company
Chicago, IL, United States
Heat Sink Compound, Tube, 4Oz; Dispensing Method Techspray
69K8373
Heat Sink Compound, Tube, 4Oz; Dispensing Method Techspray 69K8373
HEAT SINK COMPOUND, TUBE, 4OZ; Dispensing Method:Tube; Volume:-; Weight:4oz; Product Range:-; Coating Applications:Heat Sinks, Power Transistors; Coating Type:Conductive; Colour:White RoHS Compliant: Yes

HEAT SINK COMPOUND, TUBE, 4OZ; Dispensing Method:Tube; Volume:-; Weight:4oz; Product Range:-; Coating Applications:Heat Sinks, Power Transistors; Coating Type:Conductive; Colour:White RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 69K8373
Product Name Heat Sink Compound, Tube, 4Oz; Dispensing Method Techspray
Unlock Full Specs
to access all available technical data

Similar Products

Thermal gel for cpu - SE40 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements - EP17HTDA-2 - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Chemical System Epoxy
View Details