Techspray, an ITW Company Heat Sink Compound, Tube, 4Oz; Dispensing Method Techspray 1977-DP

Description
HEAT SINK COMPOUND, TUBE, 4OZ; Dispensing Method:Tube; Volume:-; Weight:4oz; Product Range:-; Coating Applications:Heat Sinks, Power Transistors; Coating Type:Conductive; Colour:White RoHS Compliant: Yes
  • Heat Sink Compound, Tube, 4Oz; Dispensing Method Techspray - 69K8373 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
HEAT SINK COMPOUND, TUBE, 4OZ; Dispensing Method:Tube; Volume:-; Weight:4oz; Product Range:-; Coating Applications:Heat Sinks, Power Transistors; Coating Type:Conductive; Colour:White RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Heat Sink Compound, Tube, 4Oz; Dispensing Method Techspray - 69K8373 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Heat Sink Compound, Tube, 4Oz; Dispensing Method Techspray
69K8373
Heat Sink Compound, Tube, 4Oz; Dispensing Method Techspray 69K8373
HEAT SINK COMPOUND, TUBE, 4OZ; Dispensing Method:Tube; Volume:-; Weight:4oz; Product Range:-; Coating Applications:Heat Sinks, Power Transistors; Coating Type:Conductive; Colour:White RoHS Compliant: Yes

HEAT SINK COMPOUND, TUBE, 4OZ; Dispensing Method:Tube; Volume:-; Weight:4oz; Product Range:-; Coating Applications:Heat Sinks, Power Transistors; Coating Type:Conductive; Colour:White RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 69K8373
Product Name Heat Sink Compound, Tube, 4Oz; Dispensing Method Techspray
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-3 - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
T-3
Specs
Cure / Technology Single Component
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 850 F (0 to 454 C)
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Good flexibility silicone thermal pad for heat pipe assemblies - SF1500 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Good flexibility silicone thermal pad for heat pipe assemblies
SF1500
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -40 to 248 F (-40 to 120 C)
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details