ITW Devcon Devcon Potting & Encapsulating Compound - 1 lb - 10710 10710

Description
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 75 min working time. Works in a mix ratio of 5:1. Delivers great performance with a shear strength of 2700 psi.
Datasheet
Description
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 75 min working time. Works in a mix ratio of 5:1. Delivers great performance with a shear strength of 2700 psi.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Devcon Potting & Encapsulating Compound - 1 lb - 10710 - 078143-10710 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Devcon Potting & Encapsulating Compound - 1 lb - 10710
078143-10710
Devcon Potting & Encapsulating Compound - 1 lb - 10710 078143-10710
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 75 min working time. Works in a mix ratio of 5:1. Delivers great performance with a shear strength of 2700 psi.

Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 75 min working time. Works in a mix ratio of 5:1. Delivers great performance with a shear strength of 2700 psi.

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Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number 078143-10710
Product Name Devcon Potting & Encapsulating Compound - 1 lb - 10710
Dielectric Strength 100 kV/in (39.37 kV/cm)
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