ITW Devcon Devcon Potting & Encapsulating Compound - 1 lb - 10710 10710

Description
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 75 min working time. Works in a mix ratio of 5:1. Delivers great performance with a shear strength of 2700 psi.
Datasheet
Description
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 75 min working time. Works in a mix ratio of 5:1. Delivers great performance with a shear strength of 2700 psi.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Devcon Potting & Encapsulating Compound - 1 lb - 10710 - 078143-10710 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Devcon Potting & Encapsulating Compound - 1 lb - 10710
078143-10710
Devcon Potting & Encapsulating Compound - 1 lb - 10710 078143-10710
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 75 min working time. Works in a mix ratio of 5:1. Delivers great performance with a shear strength of 2700 psi.

Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 75 min working time. Works in a mix ratio of 5:1. Delivers great performance with a shear strength of 2700 psi.

Buy Now Datasheet

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number 078143-10710
Product Name Devcon Potting & Encapsulating Compound - 1 lb - 10710
Dielectric Strength 100 kV/in (39.37 kV/cm)
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Bonding - Tuffbond 316 - 3316AB22 - Hernon Manufacturing, Inc.
Specs
Form / Function 50 ml (two component)
Cure / Technology Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Elastomeric
View Details
UL Certified Epoxy Encapsulant Resists Arcing Without Igniting - EP21AC - Master Bond, Inc.
Specs
Type High Dielectric
Form / Function Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
View Details
Dymax Multi-Cure 9001-E-V3.1 UV Curing Encapsulant Clear 30 mL MR Syringe - 9001-E-V3.1 30ML MR SYR - Ellsworth Adhesives
Specs
Cure / Technology Single Component
Tensile (Break) 750 psi (5171 KPa)
Elongation 150.0 %
View Details
Potting Compounds - 1810373 - RS Components, Ltd.
RS Components, Ltd.
Specs
Form / Function Bottle; Liquid
Chemical System Epoxy; Epoxy
View Details