ITW Devcon Devcon Potting & Encapsulating Compound - 3 lb - 10620 10620

Description
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 60 min working time. Works in a mix ratio of 4:1. Delivers great performance with a shear strength of 2600 psi.
Datasheet
Description
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 60 min working time. Works in a mix ratio of 4:1. Delivers great performance with a shear strength of 2600 psi.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Devcon Potting & Encapsulating Compound - 3 lb - 10620 - 078143-10620 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Devcon Potting & Encapsulating Compound - 3 lb - 10620
078143-10620
Devcon Potting & Encapsulating Compound - 3 lb - 10620 078143-10620
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 60 min working time. Works in a mix ratio of 4:1. Delivers great performance with a shear strength of 2600 psi.

Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 60 min working time. Works in a mix ratio of 4:1. Delivers great performance with a shear strength of 2600 psi.

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Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Encapsulants and Potting Compounds
Product Number 078143-10620
Product Name Devcon Potting & Encapsulating Compound - 3 lb - 10620
Dielectric Strength 100 kV/in (39.37 kV/cm)
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