HORIBA Instruments, Inc. Wafer Back Side Cooling Pressure Controller GR-300 Series

Description
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system. The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems. Pressure control with more stability and accuracy Mass flow sensor (Option) Compatible for various fitting RoHS compliance Application example In the below example, the GR-300 Series is controlling the gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.
Description
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system. The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems. Pressure control with more stability and accuracy Mass flow sensor (Option) Compatible for various fitting RoHS compliance Application example In the below example, the GR-300 Series is controlling the gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.

Suppliers

Company
Product
Description
Supplier Links
Wafer Back Side Cooling Pressure Controller - GR-300 Series - HORIBA Instruments, Inc.
Irvine, CA, United States
Wafer Back Side Cooling Pressure Controller
GR-300 Series
Wafer Back Side Cooling Pressure Controller GR-300 Series
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system. The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems. Pressure control with more stability and accuracy Mass flow sensor (Option) Compatible for various fitting RoHS compliance Application example In the below example, the GR-300 Series is controlling the gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.

The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.

The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.

  • Pressure control with more stability and accuracy
  • Mass flow sensor (Option)
  • Compatible for various fitting
  • RoHS compliance

Application example

In the below example, the GR-300 Series is controlling the gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.

Supplier's Site

Technical Specifications

  HORIBA Instruments, Inc.
Product Category Pressure Controllers
Product Number GR-300 Series
Product Name Wafer Back Side Cooling Pressure Controller
Form Factor Stand-Alone
Unlock Full Specs
to access all available technical data

Similar Products

Pressure Controls - 836T-D463J - Allen-Bradley / Rockwell Automation
Allen-Bradley / Rockwell Automation
View Details
Cordis Electronic Pressure Controls with External Sensor - CPC-Z Series - Clippard
Specs
Control Linear
Form Factor Chassis
Media Gas
View Details
Environmental Test Chamber Touch Screen Controller - CSZ EZT-570S - Cincinnati Sub-Zero Products
Specs
Controller Type Environmental; Laboratory
Control Limit; PID; Fuzzy Logic
Features Datalogger; Is a Chart Recorder
View Details