Hernon Manufacturing, Inc. Formulations - Applications - Bonding - HASA 66071 36607130

Description
HASA 66071 is a single component structural anaerobic adhesive formulated for bonding rigid assemblies at high temperatures. HASA 66071 cures when it is confined between mating surfaces. Hernon® Primer 50 accelerates the cure.
Datasheet
Description
HASA 66071 is a single component structural anaerobic adhesive formulated for bonding rigid assemblies at high temperatures. HASA 66071 cures when it is confined between mating surfaces. Hernon® Primer 50 accelerates the cure.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Formulations - Applications - Bonding - HASA 66071 - 36607130 - Hernon Manufacturing, Inc.
Sanford, FL, United States
Formulations - Applications - Bonding - HASA 66071
36607130
Formulations - Applications - Bonding - HASA 66071 36607130
HASA 66071 is a single component structural anaerobic adhesive formulated for bonding rigid assemblies at high temperatures. HASA 66071 cures when it is confined between mating surfaces. Hernon® Primer 50 accelerates the cure.

HASA 66071 is a single component structural anaerobic adhesive formulated for bonding rigid assemblies at high temperatures. HASA 66071 cures when it is confined between mating surfaces. Hernon® Primer 50 accelerates the cure.

Supplier's Site Datasheet

Technical Specifications

  Hernon Manufacturing, Inc.
Product Category Industrial Adhesives
Product Number 36607130
Product Name Formulations - Applications - Bonding - HASA 66071
Cure / Technology Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Features Thermally Conductive
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Formulations - Applications - Bonding - Tuffbond 302 - 3302AB22 - Hernon Manufacturing, Inc.
Specs
Chemical System Ceramic; Epoxy
Features Encapsulant, Potting Compound
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Formulations - Applications - Bonding - Fusionbond 375 - 3375AB22 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Two Component  
Chemical System Vinyl; Acrylic
Substrate Compatibility Metal; Plastic; PVC, acrylic, ABS, stainless steel, and some types of fiberglass
View Details
Formulations - Applications - Bonding - Ultrabond 786 - 378625 - Hernon Manufacturing, Inc.
Specs
Chemical System Ceramic
Substrate Compatibility Ceramic, Glass; Metal; Plastic; Variety of substrates like metals, glass, ceramics and plastics
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details