Bergquist Company (The) Sil-Pad A1500, .010, 4x4 Sheet; Thickness Bergquist SPA1500-0.010-00-4/4

Description
SIL-PAD A1500, .010", 4"X4" SHEET; Thickness:0.2mm; Conductive Material:Silicone, Fibreglass; Thermal Conductivity:2W/m.K; Thermal Impedance:-; Volume Resistivity:100000Mo hm-m; External Length:100mm; External Width:100mm; Product RoHS Compliant: Yes
  • Sil-Pad A1500, .010, 4x4 Sheet; Thickness Bergquist - 18K6980 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
SIL-PAD A1500, .010", 4"X4" SHEET; Thickness:0.2mm; Conductive Material:Silicone, Fibreglass; Thermal Conductivity:2W/m.K; Thermal Impedance:-; Volume Resistivity:100000Mo hm-m; External Length:100mm; External Width:100mm; Product RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Sil-Pad A1500, .010, 4x4 Sheet; Thickness Bergquist - 18K6980 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Sil-Pad A1500, .010, 4x4 Sheet; Thickness Bergquist
18K6980
Sil-Pad A1500, .010, 4x4 Sheet; Thickness Bergquist 18K6980
SIL-PAD A1500, .010", 4"X4" SHEET; Thickness:0.2mm; Conductive Material:Silicone, Fibreglass; Thermal Conductivity:2W/m.K; Thermal Impedance:-; Volume Resistivity:100000Mo hm-m; External Length:100mm; External Width:100mm; Product RoHS Compliant: Yes

SIL-PAD A1500, .010", 4"X4" SHEET; Thickness:0.2mm; Conductive Material:Silicone, Fibreglass; Thermal Conductivity:2W/m.K; Thermal Impedance:-; Volume Resistivity:100000Mohm-m; External Length:100mm; External Width:100mm; Product RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 18K6980
Product Name Sil-Pad A1500, .010, 4x4 Sheet; Thickness Bergquist
Thermal Conductivity 2 W/m-K (1.16 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Pads - 7943979 - RS Components, Ltd.
RS Components, Ltd.
Thermal Pads
7943979
View Details
Heat Transfer Compound - T-99 - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
T-99
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details
One Part Epoxy Adhesive for Underfill Applications - EP3UF - Master Bond, Inc.
Master Bond, Inc.
One Part Epoxy Adhesive for Underfill Applications
EP3UF
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
View Details
Thermal Interface Material- Gap Filler Pads (Putty) - SARCON®PG65A - Fujipoly® America Corp.
Fujipoly® America Corp.
Thermal Interface Material- Gap Filler Pads (Putty)
SARCON®PG65A
Specs
Form / Shape Pad; Putty; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; OEM or Industrial
View Details