LOCTITE HF 108, Solder paste, Pb-free soldering LOCTITE® HF 108 is a high tack, low voiding, RoHS-compliant solder paste designed for medium to large boards. Excellent fine pitch coalescence. Robust reflow process window with exceptional solderability across a wide range of challenging surfaces finishes including immersion Ag and OSP Cu.
Colorless residues for easy post-reflow inspection
Suitable for fine pitch, high speed printing up to 200mm/s (6"/s)
Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582.
Halogen-free flux classification: ANSI/J-STD-004 Rev. B for a type ROL0 classification.
LOCTITE HF 108, Solder paste, Pb-free soldering LOCTITE® HF 108 is a high tack, low voiding, RoHS-compliant solder paste designed for medium to large boards. Excellent fine pitch coalescence. Robust reflow process window with exceptional solderability across a wide range of challenging surfaces finishes including immersion Ag and OSP Cu.
- Colorless residues for easy post-reflow inspection
- Suitable for fine pitch, high speed printing up to 200mm/s (6"/s)
- Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582.
- Halogen-free flux classification: ANSI/J-STD-004 Rev. B for a type ROL0 classification.
