Henkel Corporation - Industrial Encapsulants LOCTITE ECCOBOND DS 3318BLX

Datasheet

Suppliers

Company
Product
Description
Supplier Links
Encapsulants - LOCTITE ECCOBOND DS 3318BLX - Henkel Corporation - Industrial
Rocky Hill, CT, United States
LOCTITE ECCOBOND DS 3318BLX, Acrylic, Sealant, Encapsulation LOCTITE® ECCOBOND DS 3318BLX fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COF (Chip-on-Film) in LCD modules. Flexibility is a key characteristic of this material, enabling stress absorption and providing extra protection from cracking in functional testing. Fast cure High flexibility Moderate modulus Reworkable Good moisture resistance

LOCTITE ECCOBOND DS 3318BLX, Acrylic, Sealant, Encapsulation LOCTITE® ECCOBOND DS 3318BLX fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COF (Chip-on-Film) in LCD modules. Flexibility is a key characteristic of this material, enabling stress absorption and providing extra protection from cracking in functional testing.

  • Fast cure
  • High flexibility
  • Moderate modulus
  • Reworkable
  • Good moisture resistance
Supplier's Site Datasheet

Technical Specifications

  Henkel Corporation - Industrial
Product Category Industrial Sealants
Product Number LOCTITE ECCOBOND DS 3318BLX
Product Name Encapsulants
Cure / Technology UV or Radiation Cured
Unlock Full Specs
to access all available technical data

Similar Products

Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications - MasterSil 973S-LO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Addition Cure
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
ELAN-Cast® - E 494 RQ Resin / C 494 RQ Hardener - ELANTAS PDG, Inc.
Specs
Type High Dielectric
Form / Function Liquid
Cure / Technology Thermoset; Two Component  
View Details
Exceptionally Soft Thermal Conductive Gel Pad - BS89 - Shiu Li Technology Co., Ltd
Specs
Type / Form Sheet or Film
Chemical System Silicone
Features Thermally Conductive; UL Rating
View Details
 - 2641619 - RS Components, Ltd.
RS Components, Ltd.
Specs
Chemical System Silicone
Use Temperature -58 to 248 F (-50 to 120 C)
View Details