Henkel Corporation - Industrial Encapsulants LOCTITE ECCOBOND DP 1006

Description
LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive LOCTITE® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications. One component Non-conductive Extremely flexible Fast cure Low temperature cure Excellent chemical resistance Humidity resistant
  • Encapsulants - LOCTITE ECCOBOND DP 1006 - Henkel Corporation - Industrial
    Henkel Corporation - Industrial
Datasheet
Description
LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive LOCTITE® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications. One component Non-conductive Extremely flexible Fast cure Low temperature cure Excellent chemical resistance Humidity resistant
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Encapsulants - LOCTITE ECCOBOND DP 1006 - Henkel Corporation - Industrial
Henkel Corporation - Industrial
Rocky Hill, CT, United States
Encapsulants
LOCTITE ECCOBOND DP 1006
Encapsulants LOCTITE ECCOBOND DP 1006
LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive LOCTITE® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications. One component Non-conductive Extremely flexible Fast cure Low temperature cure Excellent chemical resistance Humidity resistant

LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive LOCTITE® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications.

  • One component
  • Non-conductive
  • Extremely flexible
  • Fast cure
  • Low temperature cure
  • Excellent chemical resistance
  • Humidity resistant
Supplier's Site Datasheet

Technical Specifications

  Henkel Corporation - Industrial
Product Category Industrial Adhesives
Product Number LOCTITE ECCOBOND DP 1006
Product Name Encapsulants
Features High Dielectric
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