Loctite UK Loctite Hysol 0450 Hot Melt Adhesive - Red High Melt Solid Carton - 83356 83356

Description
Loctite Hysol 0450 red hot melt adhesive is compatible with cardboard, foam, plastic, polyethylene, polystyrene, urethane and wood materials. Additionally, this hot melt adhesive is a high melt adhesive with a melting point of +156 F.
Datasheet
Description
Loctite Hysol 0450 red hot melt adhesive is compatible with cardboard, foam, plastic, polyethylene, polystyrene, urethane and wood materials. Additionally, this hot melt adhesive is a high melt adhesive with a melting point of +156 F.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Loctite Hysol 0450 Hot Melt Adhesive - Red High Melt Solid Carton - 83356 - 079340-83356 - R. S. Hughes Company, Inc.
Sunnyvale, CA, USA
Loctite Hysol 0450 Hot Melt Adhesive - Red High Melt Solid Carton - 83356
079340-83356
Loctite Hysol 0450 Hot Melt Adhesive - Red High Melt Solid Carton - 83356 079340-83356
Loctite Hysol 0450 red hot melt adhesive is compatible with cardboard, foam, plastic, polyethylene, polystyrene, urethane and wood materials. Additionally, this hot melt adhesive is a high melt adhesive with a melting point of +156 F.

Loctite Hysol 0450 red hot melt adhesive is compatible with cardboard, foam, plastic, polyethylene, polystyrene, urethane and wood materials. Additionally, this hot melt adhesive is a high melt adhesive with a melting point of +156 F.

Buy Now Datasheet

Technical Specifications

  R. S. Hughes Company, Inc.
Product Category Industrial Adhesives
Product Number 079340-83356
Product Name Loctite Hysol 0450 Hot Melt Adhesive - Red High Melt Solid Carton - 83356
Cure / Technology Thermoplastic / Hot Melt
Unlock Full Specs
to access all available technical data

Similar Products

Fiber Adhesive -  - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details
UV-Curing Epoxy, NOA 1375, 6 gm Syringe - NOA-1375S - Newport MKS
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details
Thermal conductive gel pad for mobile phone smartphone - SF400 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details