Henkel Corporation - Industrial Bonderite C-Ic Hx-357 Mu Dr272Kg Loctite 593987

Description
BONDERITE C-IC HX-357 MU DR272KG
  • Bonderite C-Ic Hx-357 Mu Dr272Kg Loctite - 98W0802 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
BONDERITE C-IC HX-357 MU DR272KG

Suppliers

Company
Product
Description
Supplier Links
Bonderite C-Ic Hx-357 Mu Dr272Kg Loctite - 98W0802 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Bonderite C-Ic Hx-357 Mu Dr272Kg Loctite
98W0802
Bonderite C-Ic Hx-357 Mu Dr272Kg Loctite 98W0802
BONDERITE C-IC HX-357 MU DR272KG

BONDERITE C-IC HX-357 MU DR272KG

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Industrial Adhesives
Product Number 98W0802
Product Name Bonderite C-Ic Hx-357 Mu Dr272Kg Loctite
Unlock Full Specs
to access all available technical data

Similar Products

Fiber Adhesive - - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Fiber Adhesive
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details
UV-Curing Epoxy, NOA 85, 6 gm Syringe - NOA-85S - Newport MKS
Newport MKS
UV-Curing Epoxy, NOA 85, 6 gm Syringe
NOA-85S
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details
High thermal conductivity carbon fiber heat sink soft thermal pad thermal gap filler for electronic devices - CSF30 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
High thermal conductivity carbon fiber heat sink soft thermal pad thermal gap filler for electronic devices
CSF30
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details
SignalSeal Services - For High FrequencyElectronics - Kayaku Advanced Materials, Inc.
Kayaku Advanced Materials, Inc.
SignalSeal Services
For High FrequencyElectronics
View Details