Hapco, Inc. Di-Pak™ Elastomeric Eletrical Insulating Compound E-4901-30

Description
Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.
Description
Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.
Datasheet
Datasheet Summary
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Di-Pak,Ñ¢ E-4901-30 is a low-cost, elastomeric electrical insulating compound designed for potting applications. It is characterized by its low viscosity and fast cycle times, making it suitable for both low and high production environments. The product is available in three different speeds to accommodate various processing needs. It is formulated to be easy to use, allowing for hand mixing or dispensing. The compound is also noted for its ability to reduce rejects during production due to its forgiving nature in application.

Datasheet Summary
Powered by GS/AI

Di-Pak,Ñ¢ E-4901-30 is a low-cost, elastomeric electrical insulating compound designed for potting applications. It is characterized by its low viscosity and fast cycle times, making it suitable for both low and high production environments. The product is available in three different speeds to accommodate various processing needs. It is formulated to be easy to use, allowing for hand mixing or dispensing. The compound is also noted for its ability to reduce rejects during production due to its forgiving nature in application.

Suppliers

Company
Product
Description
Supplier Links
Di-Pak™ Elastomeric Eletrical Insulating Compound - E-4901-30 - Hapco, Inc.
Hanover, MA, USA
Di-Pak™ Elastomeric Eletrical Insulating Compound
E-4901-30
Di-Pak™ Elastomeric Eletrical Insulating Compound E-4901-30
Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.

Supplier's Site Datasheet

Technical Specifications

  Hapco, Inc.
Product Category Encapsulants and Potting Compounds
Product Number E-4901-30
Product Name Di-Pak™ Elastomeric Eletrical Insulating Compound
Type High Dielectric
Form / Function Liquid
Cure / Technology Thermoset; Two Component  
Industry Electronics
Use Temperature 176 F (80 C)
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