Hamamatsu Photonics Europe Image sensor modules C15853-02

Description
Built-in high-speed InGaAs linear image sensor, USB 3.1 Gen1 interface This image sensor module is equipped with an InGaAs linear image sensor (G14714-1024DK). This product has sensitivity in the near infrared region of 0.95 to 1.7 µm, and is capable of readout at a high-speed line rate of 40 klines/s. It transfers the acquired image signal to a PC via a USB 3.1 Gen1 interface. Various functions can be controlled with USB communication and an external trigger signal. The SMA connector for external trigger input is attached to main body, making it possible to synchronize operation design is necessary, and image acquisition can be done easily. Features -High-speed line rate: 40 klines/s max. -Room temperature operation -Output data: 16-bit -Interface: USB 3.1 Gen1
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Description
Built-in high-speed InGaAs linear image sensor, USB 3.1 Gen1 interface This image sensor module is equipped with an InGaAs linear image sensor (G14714-1024DK). This product has sensitivity in the near infrared region of 0.95 to 1.7 µm, and is capable of readout at a high-speed line rate of 40 klines/s. It transfers the acquired image signal to a PC via a USB 3.1 Gen1 interface. Various functions can be controlled with USB communication and an external trigger signal. The SMA connector for external trigger input is attached to main body, making it possible to synchronize operation design is necessary, and image acquisition can be done easily. Features -High-speed line rate: 40 klines/s max. -Room temperature operation -Output data: 16-bit -Interface: USB 3.1 Gen1
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Suppliers

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Image sensor modules - C15853-02 - Hamamatsu Photonics Europe
Herrsching am Ammersee, Germany
Image sensor modules
C15853-02
Image sensor modules C15853-02
Built-in high-speed InGaAs linear image sensor, USB 3.1 Gen1 interface This image sensor module is equipped with an InGaAs linear image sensor (G14714-1024DK). This product has sensitivity in the near infrared region of 0.95 to 1.7 µm, and is capable of readout at a high-speed line rate of 40 klines/s. It transfers the acquired image signal to a PC via a USB 3.1 Gen1 interface. Various functions can be controlled with USB communication and an external trigger signal. The SMA connector for external trigger input is attached to main body, making it possible to synchronize operation design is necessary, and image acquisition can be done easily. Features -High-speed line rate: 40 klines/s max. -Room temperature operation -Output data: 16-bit -Interface: USB 3.1 Gen1

Built-in high-speed InGaAs linear image sensor, USB 3.1 Gen1 interface

This image sensor module is equipped with an InGaAs linear image sensor (G14714-1024DK). This product has sensitivity in the near infrared region of 0.95 to 1.7 µm, and is capable of readout at a high-speed line rate of 40 klines/s. It transfers the acquired image signal to a PC via a USB 3.1 Gen1 interface. Various functions can be controlled with USB communication and an external trigger signal. The SMA connector for external trigger input is attached to main body, making it possible to synchronize operation design is necessary, and image acquisition can be done easily.

Features
-High-speed line rate: 40 klines/s max.
-Room temperature operation
-Output data: 16-bit
-Interface: USB 3.1 Gen1

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Technical Specifications

  Hamamatsu Photonics Europe
Product Category Sensor Chips
Product Number C15853-02
Product Name Image sensor modules
Applications Industrial
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