H. B. Fuller Company HB Fuller HL3363 Hot Melt Adhesive Pillows Light Amber 31 lb Case 15002039

Description
HB Fuller HL3363 is a one component, permanent, pressure-sensitive hot melt adhesive designed for bookbinding applications. Typically used as a soft cover side glue and joint/hinge adhesive for hard cover books. Light Amber, 31 lb Case.
Request a Quote Datasheet
Description
HB Fuller HL3363 is a one component, permanent, pressure-sensitive hot melt adhesive designed for bookbinding applications. Typically used as a soft cover side glue and joint/hinge adhesive for hard cover books. Light Amber, 31 lb Case.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
HB Fuller HL3363 Hot Melt Adhesive Pillows Light Amber 31 lb Case - HL3363 31LB PILLOWS - Ellsworth Adhesives
Germantown, WI, USA
HB Fuller HL3363 Hot Melt Adhesive Pillows Light Amber 31 lb Case
HL3363 31LB PILLOWS
HB Fuller HL3363 Hot Melt Adhesive Pillows Light Amber 31 lb Case HL3363 31LB PILLOWS
HB Fuller HL3363 is a one component, permanent, pressure-sensitive hot melt adhesive designed for bookbinding applications. Typically used as a soft cover side glue and joint/hinge adhesive for hard cover books. Light Amber, 31 lb Case.

HB Fuller HL3363 is a one component, permanent, pressure-sensitive hot melt adhesive designed for bookbinding applications. Typically used as a soft cover side glue and joint/hinge adhesive for hard cover books. Light Amber, 31 lb Case.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number HL3363 31LB PILLOWS
Product Name HB Fuller HL3363 Hot Melt Adhesive Pillows Light Amber 31 lb Case
Cure / Technology Thermoplastic / Hot Melt; Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Elemelt SEALPAK HMS940 Hot Melt Adhesive Glue Sticks Amber 0.5 in x 10 in Stick 11 lb Case - ELEMELT SEALPAK HMS940-5-10A - Ellsworth Adhesives
Specs
Cure / Technology Thermoplastic / Hot Melt; Single Component
Chemical System Gum
Features Sealant
View Details
Heat Transfer Compound - T-85 - Thermon, Inc
Specs
Cure / Technology Single Component
Features Thermally Conductive
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Formulations - Applications - Bonding - Ultrabond 748 - 374825 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Thermoset; Single Component
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Two Component, Room Temperature Curing Epoxy For Bonding, Coating, Sealing And Potting - EP88FL - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Composition Unfilled
View Details