H. B. Fuller Company HB Fuller HL7216 Hot Melt Adhesive Pillows Light Amber 31 lb Case 15000366

Description
HB Fuller HL7216 is a one component, general purpose, flexible hot melt adhesive with a slow set time. Ideal for hard to bond substrates such as lining-up adhesive in bookbinding. Light Amber, 31 lb Case.
Request a Quote Datasheet
Description
HB Fuller HL7216 is a one component, general purpose, flexible hot melt adhesive with a slow set time. Ideal for hard to bond substrates such as lining-up adhesive in bookbinding. Light Amber, 31 lb Case.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
HB Fuller HL7216 Hot Melt Adhesive Pillows Light Amber 31 lb Case - HL7216 31LB PILLOW - Ellsworth Adhesives
Germantown, WI, USA
HB Fuller HL7216 Hot Melt Adhesive Pillows Light Amber 31 lb Case
HL7216 31LB PILLOW
HB Fuller HL7216 Hot Melt Adhesive Pillows Light Amber 31 lb Case HL7216 31LB PILLOW
HB Fuller HL7216 is a one component, general purpose, flexible hot melt adhesive with a slow set time. Ideal for hard to bond substrates such as lining-up adhesive in bookbinding. Light Amber, 31 lb Case.

HB Fuller HL7216 is a one component, general purpose, flexible hot melt adhesive with a slow set time. Ideal for hard to bond substrates such as lining-up adhesive in bookbinding. Light Amber, 31 lb Case.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number HL7216 31LB PILLOW
Product Name HB Fuller HL7216 Hot Melt Adhesive Pillows Light Amber 31 lb Case
Cure / Technology Thermoplastic / Hot Melt; Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Precision Camera Module Adhesive Solutions - ALPHA ® HiTech ® UP44-5566T - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Single Component
Industry Electronics; Semiconductors, IC's
View Details
Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation - EP29LPSPND-3 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Features High Dielectric; Sealant; Thermal Insulation
View Details