TE Connectivity Glue, Adhesives, Applicators 275447-1

Description
SEALING & DIELECTRIC COMPOUND
Request a Quote Datasheet
Description
SEALING & DIELECTRIC COMPOUND
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Glue, Adhesives, Applicators - 1111-275447-1-ND - DigiKey
Thief River Falls, MN, United States
Glue, Adhesives, Applicators
1111-275447-1-ND
Glue, Adhesives, Applicators 1111-275447-1-ND
SEALING & DIELECTRIC COMPOUND

SEALING & DIELECTRIC COMPOUND

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Industrial Sealants
Product Number 1111-275447-1-ND
Product Name Glue, Adhesives, Applicators
Unlock Full Specs
to access all available technical data

Similar Products

C-SHIELD RF Conductive Caulking Compound and Sealer -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type / Form Liquid
Features Caulk, Grout; Electrically Conductive
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Type / Form Liquid; Sheet or Film
Features EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details
Thermally Conductive Room temperature Curing Epoxy - EP21AN - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
View Details
Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Features Gap Filler, Foam in Place Gasket; Thermally Conductive
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details