TE Connectivity Glue, Adhesives, Applicators 275447-1

Description
SEALING & DIELECTRIC COMPOUND
Request a Quote Datasheet
Description
SEALING & DIELECTRIC COMPOUND
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Glue, Adhesives, Applicators - 1111-275447-1-ND - DigiKey
Thief River Falls, MN, United States
Glue, Adhesives, Applicators
1111-275447-1-ND
Glue, Adhesives, Applicators 1111-275447-1-ND
SEALING & DIELECTRIC COMPOUND

SEALING & DIELECTRIC COMPOUND

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Industrial Sealants
Product Number 1111-275447-1-ND
Product Name Glue, Adhesives, Applicators
Unlock Full Specs
to access all available technical data

Similar Products

Sealants - 1945890 - RS Components, Ltd.
RS Components, Ltd.
Specs
Chemical System Silicone
Industry General purpose
View Details
Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Features Gap Filler, Foam in Place Gasket; Thermally Conductive
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions - EP93FRHT - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
View Details
C-SHIELD RF Conductive Caulking Compound and Sealer -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type / Form Liquid
Features Caulk, Grout; Electrically Conductive
View Details